Thermally Conductive Adhesive Composition for Low-Volatility Bonding
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Solution Overview
Problem
Conventional thermally conductive compositions face challenges in simultaneously achieving low viscosity, high thermal conductivity, and high adhesion while maintaining reliability in environments with varying temperatures, often leading to volatilization and peeling due to the use of high molecular weight epoxy resins and low molecular weight binders or plasticizers.
Innovation Solution
A curable thermally conductive adhesive comprising a curable binder and a thermally conductive filler, with specific properties such as a mass loss rate of 1.5% or less and an elastic modulus of 1.2×10^8 Pa or less after thermal cycling, ensuring low viscosity and high reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high molecular weight epoxy resins are used to ensure high thermal conductivity and adhesion, then thermal conductivity and adhesion are improved, but viscosity increases and workability deteriorates
Solution Approach 1:
The patent changes the molecular weight parameter of the epoxy resin from high (conventional) to medium range (3000-10000), and adjusts the curing agent molecular weight to medium-high range (1000-3000). This parameter optimization achieves the right balance between viscosity (workability) and adhesion strength, resolving the contradiction between ease of operation and reliability.
Solution Approach 2:
The patent creates a composite binder system combining epoxy resin with specific molecular weight range (3000-10000) and curing agent with molecular weight range (1000-3000), along with silane compounds and thermally conductive fillers. This composite material approach achieves both low viscosity for good workability and high adhesion for reliability.
2Ease of operation
If low molecular weight binders or plasticizers are added to lower viscosity, then workability is improved, but volatilization occurs under thermal cycling and reliability deteriorates
Solution Approach 1:
Instead of using low molecular weight binders or plasticizers that cause volatilization, the patent selects epoxy resin with medium molecular weight (3000-10000) and curing agent with medium-high molecular weight (1000-3000). This parameter selection achieves low enough viscosity for good workability while maintaining high enough molecular weight to prevent volatilization under thermal cycling, thus improving reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive maintains favorable thermal conductivity and adhesion without volatilization or peeling, even under thermal cycling, by regulating mass loss and elastic modulus within specified ranges, enhancing reliability and workability.
Implementation Method 1
Thermally conductive compositions in general are curable, and are often used as cured products after being applied and then cured
Implementation Method 2
Thermally conductive compositions are used by, for example, being applied between a heating element and a heat dissipating element to propagate heat produced by the heating element and dissipate it from the heat dissipating element
Implementation Method 3
thermally conductive compositions from the viewpoint of ensuring adhesion to battery cells, module cases, cooling plates, and the like may be required to have increased adhesion to various components
Data Source
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AI summary
A curable thermally conductive adhesive comprising a curable binder and a thermally conductive filler, wherein a cured product of the curable thermally conductive adhesive has a mass loss rate of 1.5% or less after a thermal cycling test wherein a cycle consisting of 3 hours at -40°C and 3 hours at 80°C is repeated 20 times, and an elastic modulus at 80°C of 1.2×108 Pa or less.