Thermally Conductive Adhesive Sheet for Low-Temperature Electrostatic Chucks
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Solution Overview
Problem
Conventional adhesive sheets used in semiconductor manufacturing for thermal interface applications face challenges at low temperatures, experiencing increased thermal stress and peeling or cracking due to high elastic modulus and reduced thermal conductivity when filled with inorganic fillers.
Innovation Solution
A resin composition comprising a polyimide resin with a siloxane unit, an epoxy resin, a siloxane diamine, and a thermally conductive filler is used, which controls filler dispersibility and reduces elastic modulus, maintaining high adhesive strength and thermal conductivity even at -30°C or less.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a large amount of inorganic filler is added to increase thermal conductivity, then thermal conductivity is improved, but elastic modulus increases in low temperature range causing thermal stress and peeling or cracking
Solution Approach 1:
The patent changes the chemical composition parameters of the resin system by incorporating polyimide resin with siloxane units, epoxy resin, and siloxane diamine curing agent. This compositional parameter change enables the adhesive to maintain low elastic modulus and high flexibility in the -30°C or lower temperature range while achieving high thermal conductivity through controlled filler dispersion, thereby resolving the contradiction between thermal conductivity and elastic modulus.
Solution Approach 2:
The patent creates a composite adhesive material system combining organic resin components (polyimide with siloxane units, epoxy resin, siloxane diamine) with inorganic thermally conductive fillers. This composite structure allows the organic matrix to provide flexibility and low elastic modulus at low temperatures while the inorganic filler provides thermal conductivity, thus resolving the contradiction between these two properties.
2Ease of manufacture
If conventional acrylic or silicone adhesive sheets are used, then ease of manufacture is maintained, but peeling or cracking occurs in low temperature range of -30°C or less
Solution Approach 1:
The patent modifies the chemical composition parameters by using polyimide resin containing siloxane units combined with epoxy resin and siloxane diamine. This parameter change in the resin system provides exceptional low-temperature flexibility and adhesion, preventing peeling and cracking at -30°C or lower while maintaining ease of manufacture through a straightforward formulation approach with thermally conductive fillers.
3Temperature
If inorganic filler is added to improve thermal conductivity, then thermal conductivity is increased, but dispersibility control becomes difficult leading to peeling or cracking
Solution Approach 1:
The patent develops a composite resin system where polyimide resin with siloxane units, epoxy resin, and siloxane diamine work synergistically to provide excellent filler dispersibility. The siloxane-containing polymers create a matrix that effectively distributes thermally conductive fillers, preventing aggregation and ensuring uniform dispersion, thereby achieving high thermal conductivity without compromising compositional stability or causing peeling and cracking.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides an adhesive sheet with low elastic modulus, high adhesive strength, and excellent thermal conductivity at low temperatures, preventing peeling and cracking, and enhancing the efficiency of thermal management in semiconductor processing.
Implementation Method 1
a polyimide resin containing a siloxane unit
Implementation Method 2
a thermally conductive filler
Implementation Method 3
an epoxy resin; (C) a siloxane diamine
Data Source
AI summary
Disclosed is a thermally conductive sheet that has a high thermal conductivity, a low elastic modulus in a low temperature range of −30° C. or less, and excellent adhesive strength. Also provided is a thermally conductive sheet by using a resin composition containing: (A) a polyimide resin containing a siloxane unit; (B) an epoxy resin; (C) a siloxane diamine; and (D) a thermally conductive filler. Methods of making and using such thermally conductive sheets are also disclosed.