Thermal Conductive Adhesive for Wavelength Conversion Module
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Projection devices using phosphor wheels with pure silica gel or transparent adhesive bonding layers face issues with unstable coating thickness and high thermal conductivity, leading to poor heat dissipation and potential burnout of the phosphor sheet, affecting luminous efficiency and reliability.
Innovation Solution
A wavelength conversion module with a thermal conductive adhesive layer containing particles, which provides higher thermal conductivity and uniform thickness, ensuring even heat dissipation and preventing local heat accumulation, thereby maintaining the excitation efficiency and reliability of the phosphor wheel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If pure silica gel or transparent adhesive is used as bonding layer, then the phosphor sheet can be attached to substrate, but the coating thickness is unstable and heat dissipation is poor
Solution Approach 1:
The patent changes the physical parameters of the bonding layer by incorporating thermal conductive particles (such as aluminum oxide, aluminum nitride, or boron nitride particles with specific size ranges of 1-50 micrometers) into the adhesive material. This modifies the thermal conductivity parameter from typical adhesive values to enhanced values (thermal conductivity coefficient ≥1.0 W/(m·K)), while maintaining the bonding function. The particle concentration is controlled at 10-90 volume% to optimize both thermal performance and coating uniformity.
Solution Approach 2:
The patent creates a composite bonding layer material by combining traditional adhesive materials with thermal conductive particles. This composite structure integrates the bonding capability of the adhesive with the thermal conduction capability of the particles, achieving dual functionality. The composite material formulation includes specific particle size distributions and concentration ranges to ensure both uniform coating application and effective heat dissipation.
2Reliability
If pure silica gel or transparent adhesive is used as bonding layer, then the phosphor sheet can be attached to substrate, but heat accumulates at local areas with thicker adhesive
Solution Approach 1:
The patent fundamentally changes the thermal parameter of the bonding layer by incorporating high thermal conductivity particles. The thermal conductivity coefficient is enhanced to ≥1.0 W/(m·K) through adding particles such as aluminum oxide, aluminum nitride, or boron nitride. This parameter change enables the bonding layer to conduct heat away from the phosphor sheet uniformly, preventing local heat accumulation even in areas with varying adhesive thickness.
Solution Approach 2:
The patent converts the previously harmful effect of thick adhesive layers (which caused heat accumulation) into a beneficial thermal conduction path. By embedding thermal conductive particles throughout the adhesive matrix, the thicker adhesive regions transform from heat traps into effective heat dissipation channels, converting the manufacturing variability from a harmful factor into a less critical parameter.
3Ease of manufacture
If adhesive thickness varies, then coating is easier to apply, but heat dissipation becomes uneven affecting excitation efficiency
Solution Approach 1:
The patent changes the thermal properties of the bonding layer material to compensate for thickness variations. By incorporating thermal conductive particles with controlled size distribution (1-50 micrometers) and concentration (10-90 volume%), the material's thermal conductivity is enhanced sufficiently that even areas with thicker adhesive application can effectively conduct heat. This parameter change decouples the relationship between coating thickness precision and heat dissipation performance.
Solution Approach 2:
The patent creates a particulate-filled composite structure within the bonding layer that resembles a controlled porous or heterogeneous medium. The thermal conductive particles are distributed throughout the adhesive matrix, creating multiple parallel thermal conduction paths. This structure ensures that heat can flow through various routes, making the overall heat dissipation less sensitive to local variations in adhesive thickness and maintaining consistent excitation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves thermal uniformity and heat dissipation efficiency, preventing burnout and ensuring good optical quality and reliability in projection devices by evenly conducting heat away from the wavelength conversion layer.
Implementation Method 1
the thermal conductive adhesive layer includes a plurality of particles, the particles are distributed in the thermal conductive adhesive layer... the wavelength conversion module has higher thermal conductivity... the heat may be evenly and smoothly conducted to the substrate
Data Source
AI summary
A wavelength conversion module and a projection device are provided. The wavelength conversion module includes a substrate, a wavelength conversion layer and a thermal conductive adhesive layer. The wavelength conversion layer is located on the substrate. The thermal conductive adhesive layer is located between the wavelength conversion layer and the substrate. The thermal conductive adhesive layer includes a plurality of particles, the particles are distributed in the thermal conductive adhesive layer, and a particle concentration of the particles has a volume ratio greater than 0% and less than or equal to 80%.