Symmetrical Thermal Air Manifold for Uniform Multi-DUT Testing

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Solution Overview

Problem

Existing electrical testing equipment for devices such as semiconductors faces inefficiencies in testing multiple units simultaneously due to mutual interference and airflow obstruction, leading to non-uniform temperature distribution and reduced accuracy.

Innovation Solution

A manifold system with a structurally symmetrical flow path design that distributes a single thermal air inlet evenly to multiple nozzles, ensuring uniform flow rate and temperature across each nozzle, thereby maintaining consistent thermal conditions for each device-under-test.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If multiple DUTs are placed in a single chamber to test multiple devices simultaneously, then testing productivity increases, but mutual interference and airflow obstruction occur leading to non-uniform temperature distribution

Engineering Contradiction:

Improvetesting productivityVSAvoidtemperature distribution uniformity

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The single chamber is segmented into multiple independent testing chambers, each capable of housing one DUT. Each chamber has its own airflow path and temperature control, eliminating mutual interference while enabling parallel testing of multiple devices simultaneously.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Each testing chamber is designed with localized thermal conditions, ensuring uniform temperature distribution within each chamber. The airflow paths are optimized for each individual chamber, providing consistent thermal environment for each DUT regardless of other chambers' operations.

Inventive Principle:

Principle #3Local quality

2Productivity

If multiple DUTs are placed in close proximity to increase testing capacity, then productivity increases, but electromagnetic signals and noise interfere with each other

Engineering Contradiction:

Improvetesting capacityVSAvoidelectromagnetic interference

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The testing system is divided into spatially separated chambers, physically isolating each DUT from electromagnetic interference generated by other devices. This segmentation allows simultaneous testing of multiple devices without signal crosstalk.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The chamber structure acts as an intermediary barrier between DUTs, blocking electromagnetic signals and noise from propagating between adjacent devices while still allowing thermal energy transfer through the chamber walls for temperature control.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Productivity

If DUTs obstruct airflow to increase device density, then productivity increases, but temperature control performance degrades

Engineering Contradiction:

Improvedevice densityVSAvoidtemperature control performance

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The airflow system is segmented into dedicated channels for each chamber, ensuring that DUTs in one chamber do not obstruct airflow to other chambers. Each chamber maintains optimal airflow patterns for effective temperature control.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The airflow paths are designed in three-dimensional configurations that route air around and through the chambers efficiently. This dimensional optimization allows high device density while maintaining adequate airflow and temperature control performance.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The symmetrical manifold design enhances testing accuracy and reliability by eliminating interference and airflow issues, allowing simultaneous testing of multiple devices under uniform thermal conditions, reducing setup costs and time.

Implementation Method 1

The flow path is substantially structurally symmetrical between the nozzles along a central axis of the single thermal air inlet. Each of the nozzles has a flow path length along the flow path that is substantially identical, and has a cross-sectional area in the flow path that is substantially identical

Methodology Applied

Scientific EffectFluid flow distribution:

Implementation Method 2

The thermal test head is configured to have a single chamber or cap that is designed to accommodate one or more DUTs, ensuring control and maintenance of a precise temperature within the chamber or cap

Methodology Applied

Scientific EffectConvection heating: Convection

Data Source

PatentUS20260043844A1Temperature controlled test system and manifold thereof, method of distributing working fluid using manifold, and tested device under test and method of producing the same

Publication Date: 2026.02.12 MPI CORP

AI summary

A temperature controlled test system, a manifold and a method of distributing working fluid using the manifold. A temperature controlled test system includes a working fluid supply machine to supply a working fluid, an output tube connected to the working fluid supply machine to receive the working fluid, a temperature control head connected to the output tube, and a manifold, and a plurality of testing caps. The manifold includes a single thermal air inlet that is connected to the temperature control head, a plurality of nozzles, and a distributing mechanism that is configured to distribute the working fluid to at least two nozzles. The testing caps are respectively connected to the nozzles.