Thermal Analysis Apparatus for Composite Structure Bonding Uniformity

The patent applies preliminary action by performing thermal analysis and detection before semiconductor processing occurs. The system uses heat flux application and thermal imaging to identify bonding material defects in advance, allowing preventive maintenance before defects cause processing failures. This resolves the contradiction by detecting thermal non-uniformity caused by bonding issues before they affect actual production.

The patent introduces an intermediary thermal analysis system that mediates between the bonding material application and the final thermal uniformity. The system uses heat flux as an intermediary tool to probe bonding quality, and thermal imaging as an intermediary measurement method to visualize temperature distribution. This intermediary analysis enables detection of bonding defects without directly altering the bonding process itself.

The patent applies the taking out principle by extracting the thermal analysis function from the main semiconductor processing chamber. The thermal analysis system operates as a separate, dedicated subsystem that can be added independently. This extraction reduces the complexity burden on the main processing equipment while still providing comprehensive thermal monitoring capabilities through specialized heat flux sources and thermal imaging cameras.

The patent uses copying by creating a thermal model or representation of the bonding material conditions through thermal imaging. Instead of directly measuring bonding material properties, the system captures thermal images that copy or represent the thermal state, which then serves as a proxy for assessing bonding quality. This indirect copying approach simplifies measurement while maintaining detection accuracy.