Thermal Analysis Heat Transfer Characteristic Values
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Solution Overview
Problem
Current tools for thermal analysis of electronic devices do not provide guidance on how to modify heat flow, leading to inefficient and costly solutions for reducing temperature, as designers often rely on experience or broad guidelines rather than data-driven approaches.
Innovation Solution
A method to determine heat transfer characteristic values, such as bottleneck and shortcut heat transfer characteristic values, which identify regions for improving heat flow by calculating heat flux and temperature gradient vectors, allowing for informed design modifications to enhance thermal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If traditional thermal analysis tools (infrared cameras, thermal sensors, computer modeling) are used to observe and record heat information, then heat flow information can be obtained, but no guidance is provided on how to modify the device to improve heat flow
Solution Approach 1:
The patent implements feedback by calculating bottleneck heat transfer characteristic values from thermal analysis data and using these values to identify specific regions where heat flow modifications would be most effective. The system provides actionable feedback to designers about where to add heat transfer paths or modify existing paths, transforming passive thermal observation into active thermal optimization guidance.
Solution Approach 2:
The patent introduces an intermediary computational layer that processes thermal analysis data through heat transfer characteristic value calculations. This intermediary system acts as a mediator between raw thermal data and design decisions, translating thermal observations into quantified guidance about where and how to modify heat flow paths in the device.
2Ease of operation
If designers rely on personal experience or broad design guidelines to determine heat flow improvements, then design decisions can be made, but less effective, more bulky, and/or more expensive techniques are employed
Solution Approach 1:
The patent changes the parameter space by introducing bottleneck heat transfer characteristic values as a new metric for thermal design evaluation. Instead of relying on qualitative experience or broad guidelines, designers use this quantitative parameter to objectively identify and prioritize thermal optimization opportunities, leading to more efficient and targeted design decisions.
Solution Approach 2:
The patent replaces the mechanical reliance on designer experience and intuition with an automated computational system that calculates heat transfer characteristic values. This substitution transforms subjective design processes into objective, data-driven decisions, improving both efficiency and effectiveness of thermal design.
3Volume of moving object
If the size of electronic devices is reduced, then device integration is improved, but the surface area available to channel excessive heat is reduced
Solution Approach 1:
The patent addresses the heat dissipation challenge in miniaturized devices by analyzing and optimizing heat flow paths in multiple dimensions. The bottleneck heat transfer characteristic value calculation considers three-dimensional heat flow patterns, enabling identification of optimal heat transfer path locations that efficiently utilize available space without requiring increased device volume.
Solution Approach 2:
The patent segments the thermal analysis into discrete evaluable regions by calculating bottleneck heat transfer characteristic values at multiple locations throughout the device. This segmentation allows designers to identify and address specific thermal bottlenecks in different regions, enabling targeted thermal optimization that is particularly valuable when overall device size is constrained.
Data Source
AI summary
Techniques for determining one or more heat transfer characteristic values of a structure, such as an electronic device, are disclosed. A heat flux vector magnitude and a temperature gradient vector magnitude for a portion of the structure are determined, and a product of the heat flux vector magnitude with the temperature gradient vector magnitude is obtained. More particularly, the dot product of the heat flux vector magnitude with the temperature gradient vector magnitude may be obtained to provide a bottleneck heat transfer characteristic value. Alternately or additionally, a cross product (or related operation) of the heat flux vector magnitude with the temperature gradient vector magnitude is obtained to produce a shortcut heat transfer characteristic value.