Integrated Thermal Analysis Sample Holder Assembly
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Solution Overview
Problem
Current thermal analysis devices, such as TG-DSC and TG-DTA, require complex replacement procedures and are prone to damage when boiling occurs, leading to increased costs and operational challenges due to the need for separate sample and reference substance holders and the absence of a heat sink structure in TG-DTA, which complicates the measurement of heat flow differences.
Innovation Solution
A thermal analysis device with a heat sink surrounding the sample holders, featuring a radially arranged arm configuration to enhance thermal resistance and simplify the attachment and detachment of sample holders, allowing for simultaneous TG and DSC measurements while minimizing the need for replacement of damaged components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate sample and reference substance holders are used in TG-DSC and TG-DTA devices, then simultaneous TG and DSC/DTA measurements can be performed, but the device complexity increases and replacement procedures become complex when components are damaged
Solution Approach 1:
The patent combines the sample holder and reference substance holder into a single integrated holder assembly that can be attached and detached as one unit. This merging of previously separate components simplifies the replacement procedure - when damage occurs, the entire integrated holder is replaced together rather than requiring separate replacement of individual holders, thereby reducing operational complexity while maintaining the capability to perform simultaneous TG and DSC measurements
2Device complexity
If TG-DTA configuration is used without heat sink structure, then device simplicity is maintained, but measurement of heat flow differences becomes difficult
Solution Approach 1:
The patent introduces a heat sink as an intermediary component between the sample/reference holders and the environment. This heat sink serves as a thermal reference point that enables accurate measurement of heat flow differences by providing a controlled thermal environment. The heat sink mediates the thermal interactions, allowing precise DSC measurements while the integrated holder design maintains relative structural simplicity
3Reliability
If boiling occurs during thermal analysis, then temperature sensors may be damaged, but in current devices this leads to increased costs due to complex replacement procedures
Solution Approach 1:
By merging the sample holder and reference substance holder into a single integrated assembly, the patent ensures that when damage occurs from boiling (such as to temperature sensors), the entire holder assembly can be replaced as one unit. This reduces repair costs and operational complexity compared to replacing separate holders and their associated components individually
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration simplifies the replacement process when temperature sensors are damaged and enables accurate TG-DSC measurements by ensuring equal thermal resistance and heat capacity from the sample and reference holders to the heat sink, reducing operational complexity and costs.
Implementation Method 1
a heat sink (123) coupled to each of the first sample holder (121) and the second sample holder (122) with a member having a predetermined thermal resistance
Implementation Method 2
A differential thermocouple is provided to measure the temperature difference ΔT between the temperature Ts of the sample and the temperature T R of the reference substance; the ΔT is calculated by dividing the voltage V SR at both ends of the differential thermocouple by the Seebeck coefficient inherent to the material of the thermocouple
Data Source
Figure 1
Figure 2A
Figure 2B~2C
AI summary
A thermal analysis device, a sample holder assembly and a thermal analysis method, capable of DSC measurement and TG measurement while simplifying replacement of a temperature sensor or the like upon damages. The thermal analysis device 100 according to the disclosure includes a sample holder assembly 110 that is detachably mounted, a first sample stage 221 and a second sample stage 222 that are detachably mounted, a heater (heating furnace 20) that heats the sample holder assembly 110 and the like, a temperature controller 400, a temperature measuring section 300 for detecting a temperature difference between the sample and a reference substance, and a weight measuring section (balance 103) for measuring a weight difference between the sample and the reference substance. The sample holder assembly 110 includes a first sample holder 121 for placing a sample thereon, and a second sample holder 122 for placing a reference substance thereon, as well as a heat sink 123 coupled to the first sample holder 121 and the second sample holder 122, respectively, through a member having a predetermined thermal resistance, for measuring the temperature difference or the weight difference.