Thermal Analysis Model for Semiconductor Resistors
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Solution Overview
Problem
Existing thermal analysis models for semiconductor integrated circuits are inadequate for accurately analyzing resistors with different structures and physical properties, as they fail to consider the varying heat transfer mechanisms from the intermediate portion to the terminal portions, leading to inaccurate temperature calculations.
Innovation Solution
A thermal analysis model is developed that includes an intermediate node and terminal nodes to simulate heat dissipation paths from the resistor to the substrate, with specific thermal resistances representing the electrode layer's thermal resistance, allowing for a more accurate simulation of heat transfer and temperature analysis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a simple two-thermal-resistance model is used to represent heat transfer from the intermediate portion to terminal portions, then the device complexity is reduced, but the measurement precision of temperature analysis deteriorates because it cannot account for varying thermal resistance of the substrate electrode layer
Solution Approach 1:
The terminal portion is divided into two separate thermal resistance elements: a first thermal resistance representing heat transfer from the intermediate portion to the terminal portion, and a second thermal resistance representing heat transfer from the terminal portion to the substrate. This segmentation allows the model to account for the substrate electrode layer's thermal resistance while maintaining relative simplicity.
Solution Approach 2:
The patent assigns different thermal resistance characteristics to different parts of the heat transfer path. Specifically, the second thermal resistance is configured to reflect the local thermal properties of the substrate electrode layer, allowing accurate representation of heat dissipation variations at different locations without requiring a completely complex model.
2Device complexity
If the thermal analysis model does not consider the substrate's thermal resistance, then the model configuration remains simple, but the reliability of temperature analysis deteriorates when analyzing resistors with different structures and physical properties
Solution Approach 1:
The heat transfer path is segmented into distinct thermal resistance components, with the second thermal resistance specifically representing the substrate electrode layer's thermal resistance. This segmentation enables the model to reliably account for substrate effects while maintaining a relatively simple configuration.
Solution Approach 2:
The patent introduces the second thermal resistance parameter to change the model's behavior and account for substrate thermal resistance variations. By adjusting this parameter based on the substrate electrode layer's properties, the model achieves reliable temperature analysis across different resistor structures without requiring complete model redesign.
3Measurement precision
If a detailed thermal analysis model considering all heat transfer paths is used, then the measurement precision improves, but the device complexity increases significantly
Solution Approach 1:
Instead of using a fully detailed three-dimensional thermal model, the patent segments the heat transfer path into two key thermal resistance components. This segmentation captures the essential heat dissipation mechanisms, particularly the substrate's influence, while avoiding the complexity of comprehensive detailed modeling.
Solution Approach 2:
The patent applies partial action by focusing on the two most critical thermal resistance paths: from the intermediate portion to the terminal portion, and from the terminal portion to the substrate. This partial modeling approach achieves sufficient measurement precision for temperature analysis without implementing excessive detail that would increase complexity significantly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables precise thermal analysis of resistors by accounting for the substrate's thermal resistance, reducing analysis errors and improving accuracy in temperature calculations, particularly for resistors with varying thermal resistances and electrode layer thicknesses.
Implementation Method 1
a first thermal resistance Rhs connected to the intermediate node Nhs, and imitating at least one of the terminal portions 81 on both sides
Implementation Method 2
a second thermal resistance Rm connected between the inside node Nti and the outside node Nto and arranged parallel to a different element 92 that imitates a thermal resistance of an electrode layer in a surface of the substrate 9
Data Source
AI summary
A thermal analysis model includes an intermediate node that imitates an intermediate portion and a first thermal resistance connecting to the intermediate node, and imitates the terminal portions on both sides. A terminal portion inside node connected to the first thermal resistance is configured to imitate an inside area adjacent to the intermediate portion and serves as a starting point of a first heat dissipation path to the substrate. A terminal outside node is configured to imitate an outside area separated from the intermediate portion and adjacent to the inside area in the terminal portions and serves as a starting point of a second heat dissipation path to the substrate. A second thermal resistance connects the terminal portion inside node and the terminal portion outside node and is arranged parallel to a different element imitating a thermal resistance of an electrode layer in a surface of the substrate.