Thermal Analysis Mesh Refinement via Sensitivity Indices

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Solution Overview

Problem

Existing thermal analysis methods face challenges in reducing calculation costs while maintaining accuracy, particularly due to discretization in mesh division and the lack of effective indices for determining analysis errors, which affects the accuracy of heat transfer simulations.

Innovation Solution

A thermal analysis method that initially partitions a structure or space into calculation meshes, calculates thermal management sensitivity indices based on heat flux and temperature gradients, and further subdivides regions with higher sensitivity indices to enhance accuracy and reduce computational loads.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If the entire region is divided into fine calculation meshes to maintain calculation accuracy, then the accuracy of heat transfer simulation is improved, but the computational processing load increases

Engineering Contradiction:
Improvecalculation accuracyVSAvoidcomputational processing load
Core Design Contradiction:
Measurement precisionVSProductivity

Solution Approach 1:

The patent divides the entire region into multiple partitioned regions, and further divides selected partitioned regions with high thermal management sensitivity into finer calculation meshes. This selective segmentation approach applies fine meshing only where necessary (in regions with high sensitivity indices) rather than uniformly across the entire domain, thereby maintaining calculation accuracy in critical areas while reducing the overall computational processing load compared to uniform fine meshing of the complete region.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent implements local quality by calculating thermal management sensitivity indices for each partitioned region and applying different levels of mesh refinement based on these indices. Regions with higher sensitivity indices receive finer calculation meshes to capture critical thermal behavior, while regions with lower indices use coarser meshes. This localized approach optimizes the balance between calculation accuracy and computational efficiency by adapting mesh quality to the local thermal characteristics of each region.

Inventive Principle:
Principle #3Local quality

2Productivity

If uniform mesh division is applied to reduce computational load, then the computational processing load decreases, but the calculation accuracy degrades due to discretization

Engineering Contradiction:
Improvecomputational processing loadVSAvoidcalculation accuracy
Core Design Contradiction:
ProductivityVSMeasurement precision

Solution Approach 1:

The patent employs a dynamic, adaptive mesh refinement strategy where the level of mesh division is not fixed but determined by calculated thermal management sensitivity indices. The method dynamically selects which partitioned regions require finer calculation meshes based on their sensitivity values, allowing the computational grid to adapt to the actual thermal behavior of the system. This dynamic approach prevents the accuracy degradation that would result from uniform coarse meshing while avoiding the unnecessary computational cost of uniform fine meshing throughout the entire domain.

Inventive Principle:
Principle #15Dynamics

3Measurement precision

If complex wiring patterns are modeled precisely to maintain accuracy, then the calculation accuracy is improved, but the device complexity increases

Engineering Contradiction:
Improvecalculation accuracyVSAvoidmodeling complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent segments the complex wiring patterns into multiple partitioned regions and calculates thermal management sensitivity indices for each segment. By dividing the complex structure into manageable partitions and applying selective mesh refinement based on sensitivity analysis, the method maintains calculation accuracy in thermally critical areas while simplifying the overall modeling process. This segmentation approach reduces device complexity by breaking down the complex wiring pattern analysis into systematic, region-by-region evaluation rather than requiring precise modeling of every detail throughout the entire structure.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables highly accurate heat transfer simulations by selectively increasing spatial resolution in critical regions, reducing calculation costs and avoiding degradation of accuracy due to discretization.

Implementation Method 1

calculating volume integrals for individual partitioned regions based on inner products of heat flux vectors and temperature gradient vectors

Methodology Applied
Scientific EffectHeat flux: Conduction (thermal)

Implementation Method 2

calculating volume integrals for individual partitioned regions based on inner products of heat flux vectors and temperature gradient vectors

Methodology Applied
Scientific EffectTemperature gradient: Temperature Gradient

Data Source

PatentUS20240126950A1Thermal analysis method, thermal analysis apparatus, and computer program
Publication Date: 2024.04.18 MURATA MFG CO LTD
  • US20240126950A1 patent drawing
  • US20240126950A1 patent drawing
  • US20240126950A1 patent drawing

AI summary

A thermal analysis method and apparatus, and a computer program that enable highly accurate heat transfer simulation of a structure or space, while reducing calculation costs. By performing thermal analysis on a structure or space using the calculation meshes generated by initial dividing means, the spatial distribution of heat flux vectors J and temperature gradient vectors ∇T are calculated; by calculating the volume integrals of the inner products J·∇T of the heat flux vectors J and the temperature gradient vectors ∇T for individual partitioned regions and acquiring the absolute values of the volume integrals, thermal management sensitivity indices are calculated for the partitioned regions. Subsequently, partition of calculation meshes and subdivision of partitioned regions are performed on a predetermined number of partitioned regions that indicate greater indices among the calculated thermal management sensitivity indices, for example one partitioned region. Thermal analysis is performed again using the calculation meshes.