Integrated Thermal Analysis Sensor with Adjacent Reference Ring
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional thermal analysis sensors require separate sample and reference crucibles, leading to increased size, potential thermal anomalies, and reduced sample throughput due to the need for external reference materials and separate thermal environments.
Innovation Solution
A sensor system with an integrated sample and reference sensor configuration, where the reference sensor is positioned closely to the sample sensor without physical contact, allowing for simultaneous thermal analysis without external reference materials and minimizing thermal gradients.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate sample and reference crucibles are used, then thermal analysis can be performed, but device size increases and sample throughput decreases
Solution Approach 1:
The patent combines the sample sensor and reference sensor into a single integrated sensor assembly that fits within one crucible. The sample sensor measures temperature of the sample, while the reference sensor measures temperature of the crucible wall, eliminating the need for separate crucibles and reducing device size while maintaining thermal analysis capability.
2Reliability
If separate sample and reference crucibles are used, then thermal analysis can be performed, but measurement precision decreases due to thermal anomalies
Solution Approach 1:
The patent places the reference sensor in direct contact with the crucible wall to measure the local temperature of the crucible itself, while the sample sensor measures the temperature of the sample. This local measurement approach eliminates thermal anomalies caused by heat transfer between separate crucibles and improves measurement precision by directly capturing the temperature gradient between sample and crucible.
3Measurement precision
If external reference materials are required, then reference temperature can be measured, but device complexity and operation difficulty increase
Solution Approach 1:
The patent makes the crucible wall itself serve as the reference by placing the reference sensor in direct contact with it. The crucible wall automatically provides the reference temperature measurement without requiring any external reference materials, simplifying both device configuration and operation while maintaining measurement precision.
4Reliability
If separate thermal environments are used for sample and reference, then independent measurement is possible, but sample throughput decreases due to sequential analysis requirements
Solution Approach 1:
The patent merges the sample and reference measurement capabilities into a single crucible environment, allowing both measurements to occur simultaneously during one analysis run. This eliminates the need for sequential analysis of separate crucibles and increases sample throughput while maintaining independent measurement capability through the dual-sensor design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the size of thermal analysis devices, enhances measurement precision, and increases sample throughput by ensuring equal heat exposure to both sensors, thereby improving the accuracy and efficiency of thermal analysis.
Implementation Method 1
The two crucibles are heated and/or cooled at a precisely controlled rate in a controlled environment. Differences in the thermal behavior of the sample caused by differences in specific heat, occurrence of an exothermic or endothermic reaction, or a phase change, can result in a temperature difference between the two crucibles that can be measured
Data Source
AI summary
Certain embodiments disclosed herein are directed to a sensor comprising a support member, a sample sensor coupled to the support member and comprising a sample support electrically coupled to a first set of interconnects, and a reference sensor coupled to the support member and comprising a ring coupled to a second set of interconnects, in which the ring is positioned adjacent to and surrounding at least a portion of the sample support of the sample sensor.