Thermal Array Heater with Independent Resistor Circuits

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Solution Overview

Problem

In semiconductor processing, existing heater systems face challenges in maintaining precise temperature uniformity on substrates due to heat loss and variations, which can lead to processing variations and increased processing time.

Innovation Solution

A thermal array system with a plurality of resistor circuits and nodes, connected by power and signal wires, allows for independent control and temperature sensing of each resistor circuit, enabling precise heat distribution and compensation for thermal changes through a base heater layer and a tuning layer with individually controlled heating elements and temperature sensors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single heater system is used, then the structure is simple, but temperature uniformity deteriorates due to heat loss and variations

Engineering Contradiction:
Improveheater structureVSAvoidtemperature uniformity
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The heater is divided into multiple independent resistor circuits (first resistor circuit, second resistor circuit, etc.) that can be independently controlled. Each resistor circuit is connected to separate power wires and signal wires, allowing independent temperature adjustment to compensate for heat loss and achieve uniform temperature distribution across the substrate.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the heater are designed with different thermal characteristics through the use of multiple resistor circuits with varying resistance values. The first resistor circuit has different resistance than the second resistor circuit, allowing localized temperature control to compensate for non-uniform heat loss in different areas of the substrate.

Inventive Principle:
Principle #3Local quality

2Temperature

If multiple resistor circuits with independent control are used, then temperature uniformity is improved, but device complexity increases

Engineering Contradiction:
Improvetemperature uniformityVSAvoidheater structure
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The heater structure integrates multiple functions into a single component: heating (through multiple resistor circuits), sensing (through temperature sensors connected to each resistor circuit), and control (through the controller that receives signals and adjusts power distribution). This multi-functionality reduces the need for separate dedicated heating and sensing systems.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

Temperature sensors are connected to each resistor circuit to provide real-time temperature feedback to the controller. The controller uses this feedback information to adjust the power distribution to each resistor circuit, creating a closed-loop control system that maintains temperature uniformity while managing the complexity of multiple circuits.

Inventive Principle:
Principle #23Feedback

3Measurement precision

If more power wires and signal wires are added, then control precision is improved, but manufacturing complexity increases

Engineering Contradiction:
Improvetemperature sensing precisionVSAvoidwire connection complexity
Core Design Contradiction:
Measurement precisionVSEase of manufacture

Solution Approach 1:

Multiple power wires and signal wires are routed through and connected at common nodes within the heater structure. The controller connects to these nodes to simultaneously provide power to multiple resistor circuits and receive temperature signals, reducing the number of separate connection points and simplifying the manufacturing process despite the increased number of wires.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution provides improved temperature uniformity and flexibility in heat distribution, allowing for real-time adjustments and compensation for thermal changes, thereby reducing processing variations and optimizing processing time in semiconductor applications.

Implementation Method 1

a heater has a plurality of resistor circuits... The plurality of power wires are connected to each of the plurality of nodes to provide power to the plurality of resistor circuits

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Implementation Method 2

A plurality of signal wires connects to each of the plurality of nodes to sense the temperature of each of the plurality of resistor circuits

Methodology Applied
Scientific EffectTemperature sensing: Thermistor

Data Source

PatentEP3351054B1Integrated heater and sensor system
Publication Date: 2024.01.17 WATLOW ELECTRIC MANUFACTURING CO
  • EP3351054B1 patent drawingFigure 1
  • EP3351054B1 patent drawingFigure 2A~2B
  • EP3351054B1 patent drawingFigure 2C~2D

AI summary

A thermal system includes a plurality of resistor circuits that define a number of resistor circuits Rn. The thermal system also has a plurality of nodes that connect the plurality of resistor circuits and define a number of nodes Nn. A plurality of power wires are connected to each of the plurality of nodes, and the plurality of power wires define a number of power wires Pn. A plurality of signal wires connect to each of the plurality of nodes to sense the temperature of each of the resistor circuits, and the plurality of signal wires define a number of signal wires Sn. The number of power wires Pn and the number of signal wires Sn is equal to the number of nodes Nn, and the number of resistor circuits Rn is greater than or equal to the number of nodes Nn.