Thermal Assembly Accuracy Evaluation for Substrate Processing Parts
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Solution Overview
Problem
Existing semiconductor manufacturing processes struggle to accurately evaluate the assembly accuracy of parts in substrate processing apparatuses, leading to potential process abnormalities and inefficiencies.
Innovation Solution
An evaluation apparatus that acquires data on the surface temperature distribution of assembled parts and evaluates their assembly accuracy using a learning model, allowing for real-time detection of assembly defects before the start of operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If assembly accuracy of parts is low, then manufacturing cost and assembly time are reduced, but process abnormalities and defects increase
Solution Approach 1:
The patent applies preliminary action by measuring surface temperature distribution of assembled parts before actual semiconductor manufacturing operations begin. This allows assembly accuracy to be evaluated in advance, enabling corrective actions to be taken before production starts, thus preventing process abnormalities without reducing manufacturing efficiency
2Measurement precision
If traditional evaluation methods are used, then device complexity is reduced, but detection precision of assembly defects deteriorates
Solution Approach 1:
The patent replaces complex mechanical measurement systems with thermal field-based detection. By measuring surface temperature distribution using thermal imaging or temperature sensors, the system achieves high detection precision for assembly defects without requiring complex mechanical contact measurement devices, thus resolving the contradiction between detection precision and device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate and timely evaluation of assembly accuracy, preventing process abnormalities and improving overall manufacturing efficiency by allowing for corrective actions before operation begins.
Implementation Method 1
a temperature adjustment module that adjusts a temperature of the part
Implementation Method 2
a measuring device that measures surface temperature distribution of the part
Data Source
AI summary
An evaluation apparatus includes an acquisition unit that acquires data regarding surface temperature distribution of a part that is assembled in a substrate processing apparatus; and an evaluation unit that evaluates an assembly accuracy of the part based on the acquired data regarding the surface temperature distribution of the part.