Lightweight Thermal Balancing Composite for Heat Dissipation
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Solution Overview
Problem
Conventional heat dissipation methods in electronic devices face challenges with weight, cost, and efficiency, as metal heat sinks are heavy and costly to manufacture, while graphite-based solutions have limited vertical thermal conductivity and structural issues.
Innovation Solution
A solid thermal balancing composite material is created by mixing inorganic filler powders, carbon fibers, and metal particles with a polymer adhesive blend, using a pressure molding process to form a lightweight material with enhanced thermal conductivity in both XY and Z-axis directions, reducing thermal resistance and manufacturing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If metal components are used for heat dissipation, then thermal conductivity is improved, but weight increases
Solution Approach 1:
The patent uses a composite material consisting of graphite particles (30-70 wt%), metal particles (10-50 wt%), and polymer adhesive (5-20 wt%). This composite structure combines the high thermal conductivity of metals with the light weight of graphite and polymer, achieving a balance between thermal performance and weight reduction. The specific gravity is reduced to 2.0-4.0 compared to pure metals while maintaining effective heat dissipation capability.
2Weight of moving object
If graphite base plate is used, then weight is reduced, but vertical thermal conductivity deteriorates
Solution Approach 1:
The patent introduces metal particles specifically to address the vertical thermal conductivity limitation of graphite. The metal particles are distributed within the graphite-polymer composite matrix, creating localized high-conductivity pathways in the vertical direction. This local enhancement of thermal conductivity properties allows the composite to overcome graphite's inherent directional thermal conduction limitation while maintaining overall light weight.
3Temperature
If metal heat sink is manufactured with fins, then heat dissipation efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The patent changes the manufacturing approach from traditional metal forming processes to a powder metallurgy-based compression molding process. The composite material is formed by mixing graphite particles, metal particles, and polymer adhesive, then compressing the mixture under heat and pressure. This parameter change in manufacturing method simplifies the production process, reduces the number of manufacturing steps, and lowers prime costs while still enabling fin structures for effective heat dissipation.
4Temperature
If fins are made with height for operation, then heat dissipation is improved, but adaptability to small devices deteriorates
Solution Approach 1:
The patent utilizes the flexibility and moldability of the composite material to create heat dissipation structures with varying heights and configurations. The compression molding process allows for precise control of fin height and overall component geometry, enabling adaptation to different device sizes and shapes. This parameter control in the manufacturing process provides versatility for both large and small electronic devices while maintaining effective heat dissipation performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite material achieves efficient heat dissipation with reduced weight and cost, maintaining thermal conductivity while being applicable to various device shapes, and is produced in large quantities with improved manufacturing efficiency.
Implementation Method 1
said polymer blend including a polymer material being able to perform polymerization and peroxides being able to perform polymerization for forming said polymer blend
Implementation Method 2
another one of which being able to form chemical bond on a surface of said thermally-conductive filler
Implementation Method 3
enhanced thermal conductivity in both XY and Z-axis directions, reducing thermal resistance
Implementation Method 4
performing a pressure process at least once, said pressure process including application of preliminary pressure and secondary pressure, wherein a quantity of said highly thermally conductive reinforced composite material is again poured in said molding machine subsequent to said application of said preliminary pressure and prior to said application of said secondary pressure, each of said preliminary pressure and secondary pressure being maintained at a constant pressure for at least 3 seconds for solidification
Data Source
AI summary
A solid thermal balancing composite material with lightweight is formed by a reinforced composite material pressured by a molding machine after going through a powder filling equipment. The reinforced composite material is a mixture of inorganic filler powders and polymer adhesives after granulation. The specific gravity of the solid thermal balancing composite material is no greater than 2.0. In addition, the present invention is adjustable in different shapes for various applications of heat dissipation.