Thermal Barrier Interconnect for Heat Management in Memory Systems
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing cooling systems for electronic components, especially in complex and high-density systems like SSDs and DIMMs, are inefficient, noisy, expensive, and fail to effectively dissipate heat, leading to reduced performance and potential failure due to localized hotspots and temperature sensitivity issues.
Innovation Solution
An electronic assembly with a thermal barrier interconnect, such as a flexible circuit board, is used to separate heat generating components from heat sensitive components, forming a thermal barrier that allows one board to operate at a reduced temperature, thereby protecting sensitive components and improving heat dissipation without the need for traditional heat sinks or cases.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional cooling systems (heat sinks and fans) are used to dissipate heat from electronic components, then heat dissipation capability is improved, but device complexity, noise, expense, and energy consumption increase
Solution Approach 1:
The patent divides the circuit board into multiple sections with different thermal characteristics. A first section houses heat-generating components while a second section houses heat-sensitive components, creating thermal zones that manage heat distribution without requiring complex external cooling systems. This segmentation allows different parts of the system to operate at appropriate temperatures through inherent design rather than active cooling.
2Temperature
If heat sinks are integrated into the case design for SSDs, then heat removal is improved, but adaptability to different form factors decreases
Solution Approach 1:
The circuit board design serves multiple functions simultaneously: it provides electrical connectivity, structural support, and thermal management. By integrating thermal zone management directly into the circuit board layout rather than requiring separate case-integrated heat sinks, the design becomes adaptable to various form factors including PCIe and embedded SSDs that lack traditional cases.
3Temperature
If multiple heat sinks and high-speed fans are used in high-density systems, then heat dissipation is improved, but noise and energy consumption increase
Solution Approach 1:
The system uses its own structure to manage heat rather than requiring external active cooling components. The circuit board's thermal zone design allows heat-generating components to naturally dissipate heat to the environment and heat-sensitive components to remain in cooler zones, eliminating the need for energy-consuming fans and external heat sinks.
4Volume of moving object
If heat-generating and heat-sensitive components are located close together to reduce device size, then miniaturization is achieved, but thermal interference increases
Solution Approach 1:
Different regions of the circuit board are designed with different thermal qualities. The first section is designed to tolerate and dissipate heat from power management ICs and flash memory, while the second section is designed to maintain lower temperatures for sensitive components like microcontrollers. This local differentiation of thermal characteristics allows compact design while protecting sensitive components from thermal damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces thermal issues, increases the life of SSDs by enhancing data retention, and compensates for thermal expansion and contraction across a wide temperature range, while maintaining electrical connectivity and airflow for efficient cooling.
Implementation Method 1
The thermal barrier interconnect forms a thermal barrier between the first and second circuit boards which protects the heat sensitive components from the heat generating components
Data Source
AI summary
Various embodiments described herein include systems, methods and/or devices used to dissipate heat generated by electronic components in an electronic system (e.g., a memory system that includes closely spaced memory modules). In one aspect, an electronic assembly includes a first circuit board with one or more heat generating components coupled thereto. The electronic assembly further includes a second circuit board with one or more heat sensitive components coupled thereto. The electronic assembly also includes a thermal barrier interconnect. The thermal barrier interconnect electrically couples the first circuit board to the second circuit board. In some embodiments, thermal barrier interconnect is a flexible interconnect with a lower thermal conductivity than the first circuit board and the second circuit board. The thermal barrier interconnect forms a thermal barrier between the first and second circuit boards which protects the heat sensitive components from the heat generating components.