Thermal Barrier Layer for Semiconductor Test Socket Heat Isolation

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Solution Overview

Problem

Semiconductor package components experience inaccurate testing data during high temperature tests due to heat dissipation issues, where the actual temperature of the device under test on the test socket is significantly lower than the set temperature, potentially damaging the testing circuit board.

Innovation Solution

A thermal barrier layer element is introduced, comprising an insulation pad with conductive thermal-isolation portions, such as carbon nano-tube aerogel or silica gel, placed between the probe pins and electrical contacts or the device under test, to slow down heat transfer and maintain accurate temperature testing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the DUT is tested on a test socket in high temperature test, then the testing device can maintain a predetermined temperature, but the actual temperature of the DUT on the test socket is significantly lower than the predetermined temperature due to heat dissipation

Engineering Contradiction:

Improveactual temperature of DUTVSAvoidaccuracy of testing data

Core Design Contradiction:

TemperatureVSMeasurement precision

Solution Approach 1:

A thermal barrier layer element is introduced as an intermediary between the test socket and the DUT. This thermal barrier layer includes a conductive thermal-isolation portion that mediates the thermal interaction, allowing electrical connection while reducing harmful heat dissipation from the DUT to the test socket, thereby maintaining the actual temperature of the DUT closer to the predetermined temperature.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The conductive thermal-isolation portion is made of a porous material structure that provides thermal isolation. The porous structure reduces thermal conductivity while maintaining electrical conductivity, allowing the thermal barrier layer to effectively reduce heat dissipation without compromising the electrical connection between the probe pin and the DUT.

Inventive Principle:

Principle #31Porous materials

2Temperature

If the DUT generates heat during high temperature test, then the testing can proceed at predetermined temperature, but the heat from the DUT and test socket may damage the testing circuit board

Engineering Contradiction:

Improvepredetermined temperature environmentVSAvoidheat damage to testing circuit board

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The thermal barrier layer element serves as a protective intermediary between the hot DUT/test socket and the testing circuit board. It blocks and reduces the transmission of harmful heat to the circuit board while allowing the DUT to operate at the required predetermined temperature, thus protecting the circuit board from thermal damage.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The thermal barrier layer converts the harmful heat dissipation into a beneficial thermal isolation effect. By blocking the heat flow path to the circuit board, it protects sensitive components while maintaining the necessary thermal environment for the DUT, effectively turning a harmful thermal effect into a protective function.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Measurement precision

If a thermal barrier layer element is introduced to reduce heat dissipation, then the accuracy of high temperature testing is improved, but the device complexity increases

Engineering Contradiction:

Improveaccuracy of testing dataVSAvoidstructure of testing system

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The thermal barrier layer element is implemented as a thin film or layered structure that can be integrated into the existing test socket design. This thin film approach minimizes the increase in device complexity while effectively providing thermal isolation, as it adds minimal structural bulk but delivers significant thermal management benefits.

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution ensures accurate high-temperature testing data by reducing heat dissipation to the testing circuit board, preventing damage and maintaining the predetermined temperature environment for semiconductor package components.

Implementation Method 1

The conductive thermal-isolation portion includes an aerogel having carbon nano tubes therein; or the conductive thermal-isolation portion includes a silica gel having carbon nano tubes therein

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 2

configured to at least slow down heat transfer between the probe pin and the electrical contact

Methodology Applied

Scientific EffectHeat transfer: Conduction (thermal)

Data Source

PatentUS10598724B2Testing system for semiconductor package components and its thermal barrier layer element

Publication Date: 2020.03.24 GLOBAL UNICHIP CORPORATION

AI summary

A testing system for semiconductor package components includes a testing circuit board, a test socket, at least one probe pin and a thermal barrier layer element. The testing circuit board has at least one electrical contact. The test socket is used to receive a DUT. The probe pin is located on the test socket for contacting with the DUT. The thermal barrier layer element is located between the testing circuit board and the test socket, electrically connected to the probe pin and the electrical contact, and thermally isolated the electrical contact from the probe pin.