Thermal Barrier Layer for Substrate Separation
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Solution Overview
Problem
Existing processes for separating structures from substrates using electromagnetic irradiation often result in substrate and structure degradation due to heat generated from radiation absorption, especially when they have different thermal expansion coefficients, leading to unsatisfactory results and non-recyclable sacrificial substrates.
Innovation Solution
The implementation of a thermal barrier layer transparent in the electromagnetic spectral range to absorb radiation, with a thickness and exposure time relationship that confines heat absorption, preventing excessive temperature rise and allowing for substrate recycling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the separation layer absorbs electromagnetic radiation to generate heat for decomposition, then the separation effect is improved, but the substrate and structure are degraded by excessive heat
Solution Approach 1:
The patent introduces a thermal barrier layer as an intermediary component between the separation layer and the substrate/structure. This thermal barrier layer has low thermal conductivity and acts as a heat shield, allowing the separation layer to absorb electromagnetic radiation and generate heat for decomposition while preventing excessive heat from reaching and damaging the substrate and structure. The thermal barrier layer mediates the thermal interaction, enabling effective separation without harmful thermal side effects.
2Object-affected harmful factors
If the substrate is used as a sacrificial substrate to avoid heat damage, then the structure is protected, but the substrate cannot be recycled
Solution Approach 1:
The patent segments the thermal management function from the substrate by introducing a dedicated thermal barrier layer. Instead of sacrificing the entire substrate to protect the structure, the thermal barrier layer absorbs the thermal protection function, allowing the substrate to be preserved and reused. This segmentation enables the substrate to serve its primary purpose while the thermal barrier layer handles the thermal protection, making the substrate recyclable.
3Object-affected harmful factors
If the thermal barrier layer is made thicker to improve heat protection, then the substrate and structure are better protected, but the process execution time increases
Solution Approach 1:
The patent optimizes the thermal barrier layer thickness by considering the pulse duration of electromagnetic radiation. For short pulse durations, a thinner thermal barrier layer is sufficient because there is less time for heat to diffuse through the layer and reach the substrate. This parameter optimization (adjusting thickness based on pulse duration) maintains effective heat protection while minimizing the added process time, thereby improving productivity without sacrificing protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively protects both the substrate and the structure from heat damage, enabling successful separation and recycling of the substrate while maintaining the integrity of the structure, and reducing execution time by minimizing thermal diffusion.
Implementation Method 1
the spectral range of the electromagnetic irradiations being adapted so that the separation layer(s) are absorbing in said spectral range
Implementation Method 2
the separation layer(s) decompose under the effect of the heat from the absorption of said electromagnetic irradiations
Implementation Method 3
a thermal barrier layer (4) arranged between the separation layer (3) and the structure (1)
Implementation Method 4
where D1 is the thermal diffusion coefficient of the thermal barrier layer, t is the duration of an electromagnetic pulse
Data Source
Figure 1
AI summary
This process comprises steps of a) providing the substrate (2), b) forming an absorbent separating layer (3) on the substrate (2), c) forming the structure (1) to be separated on the separating layer (3), d) exposing the separating layer (3) to electromagnetic radiation (IE) via the substrate (2) so that the separating layer (3) decomposes under the effect of the heat resulting from the absorption, the process being noteworthy in that it comprises a step b1) of forming a transparent thermal barrier layer (4) on the separating layer (3), the length of the exposure and the thickness of the thermal barrier layer (4) being tailored so that the temperature of the structure (1) to be separated remains, throughout the exposure, below a threshold above which defects are liable to appear in said structure (1).