Negative Photosensitive Polyimide Resin with Thermal Base Generation
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Solution Overview
Problem
Existing photosensitive resin compositions for polyimide precursors face challenges in forming fine patterns at low temperatures, require high-temperature imidization, suffer from thermal degradation, and lack storage stability, leading to poor chemical resistance and mechanical properties in interlayer insulating films.
Innovation Solution
A negative photosensitive resin composition containing a polymer with a polyimide precursor structure, a photopolymerization initiator, and a nitrogen-containing organic compound represented by a specific general formula, allowing imide ring-closing reactions at 200°C or lower, with additives to prevent gelation and enhance mechanical properties and chemical resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If high-temperature imidization treatment (over 300°C) is used to obtain polyimide film, then the insulation property and mechanical strength are improved, but the substrate is limited and thermal damage to electronic components occurs
Solution Approach 1:
The patent changes the imidization temperature parameter from conventional high temperature (over 300°C) to low temperature (200°C or lower) by introducing a thermal base generator that produces a base through thermal decomposition, which catalyzes the imide ring-closing reaction at reduced temperatures while maintaining film strength and insulation properties
Solution Approach 2:
The patent introduces a thermal base generator as an intermediary substance that decomposes thermally to produce a base, which then acts as a catalyst to enable low-temperature imidization. This intermediary allows the reaction to proceed at lower temperatures without direct thermal exposure of the substrate and electronic components
2Object-affected harmful factors
If low-temperature imidization (200°C or lower) is used, then thermal damage is reduced, but corrosion resistance and chemical resistance deteriorate
Solution Approach 1:
The patent creates a composite resin composition system combining polyamic acid, thermal base generator, photopolymerization initiator, and solvent. This composite formulation enables low-temperature imidization while the photopolymerization component provides crosslinking that enhances chemical resistance and corrosion resistance of the cured film
3Object-affected harmful factors
If low-temperature imidization (200°C or lower) is used, then thermal damage is reduced, but storage stability deteriorates due to gelation during storage
Solution Approach 1:
The patent incorporates a photopolymerization initiator and photopolymerizable compound into the resin composition before storage, but the actual photopolymerization crosslinking action is postponed until after application and exposure. This preliminary preparation of the composition with latent crosslinking capability prevents gelation during storage while enabling post-application crosslinking for enhanced chemical resistance
4Manufacturing precision
If fine pattern formation is achieved, then manufacturing precision is improved, but the aspect ratio and pattern deformation control become more difficult
Solution Approach 1:
The patent replaces conventional high-temperature thermal curing with low-temperature imidization combined with photopolymerization. This substitution reduces thermal energy input during curing, minimizing thermal flow and deformation of fine patterns while maintaining manufacturing precision through the catalyzed low-temperature reaction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables fine patterning at low temperatures with excellent chemical resistance, high glass transition point, and improved storage stability, resulting in reliable interlayer insulating films and surface protective films.
Implementation Method 1
a photopolymerization initiator; (B) a polymerizable compound having two or more ethylenically unsaturated groups
Implementation Method 2
a thermal base generator, which generates a base due to heat, and a solvent, the polyimide precursor being a polyamic acid and the thermal base generator is a neutral compound that undergoes thermal decomposition when heated at a temperature of 200°C or lower and generates a secondary amine
Data Source
AI summary
The present invention is a negative photosensitive resin composition containing a nitrogen-containing organic compound represented by the following general formula (1). This can provide: a photosensitive resin composition, containing a polyimide precursor, that can undergo an imide ring-closing reaction at a low temperature, has excellent stability of the composition, and makes fine patterning possible, and after curing, can be provided with resistance to chemicals; a patterning process using the photosensitive resin composition; and an interlayer insulating film and a semiconductor device including a cured film of the photosensitive resin composition.