Thermal Management Device With Integrated Bias And Spreaders
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Solution Overview
Problem
In small or mobile electronic devices, the collective height of circuit substrates, heat generating components, and traditional thermal management devices exceeds the available space, necessitating a compact thermal management solution that maintains effective thermal coupling without excessive pressure on components.
Innovation Solution
A thermal management device comprising a first and second thermal spreader, with a bias device to maintain thermal coupling between the spreaders and heat generating components, using gap fillers and flexible materials to accommodate height differences and prevent excessive pressure, allowing for efficient heat dissipation while minimizing device height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a traditional thermal management device with spring clip is used, then thermal coupling is maintained, but device height increases beyond available space
Solution Approach 1:
The patent combines the thermal spreader and bias device into an integrated assembly where the bias device is mounted directly on the thermal spreader. This merging eliminates the need for separate spring clips and reduces the number of discrete components, thereby reducing overall device height while maintaining thermal coupling effectiveness.
Solution Approach 2:
The bias device is nested on top of the thermal spreader, with the thermal interface material positioned between them. This nested arrangement allows the bias device to be contained within the vertical envelope of the thermal management assembly, minimizing the cumulative height increase that would result from stacked separate components.
2Temperature
If contact pressure is increased to improve thermal coupling, then heat dissipation improves, but component damage risk increases
Solution Approach 1:
The patent incorporates a compliant layer or cushioning element between the bias device and the heat generating component. This cushioning layer is positioned in advance to prevent excessive pressure transmission, thereby protecting the component from damage while still allowing sufficient contact pressure for effective thermal coupling.
Solution Approach 2:
The patent uses materials with specific mechanical properties (compliance, elasticity) that allow the bias device to apply pressure within an optimal range. By selecting materials with appropriate pressure distribution characteristics, the system maintains effective thermal coupling without transmitting damaging forces to the component.
3Length of moving object
If device height is reduced to fit space constraints, then space utilization improves, but thermal coupling consistency deteriorates
Solution Approach 1:
The patent employs a bias device with elastic or compliant characteristics that can dynamically adjust to height variations and surface irregularities. This dynamic adaptation ensures consistent thermal coupling pressure is maintained across the interface, compensating for manufacturing tolerances and assembly variations within the reduced height constraint.
Solution Approach 2:
The patent utilizes flexible thermal interface materials or compliant layers that can conform to surface variations. These flexible elements maintain uniform pressure distribution and consistent thermal coupling despite the reduced overall device height, accommodating height differences without compromising coupling stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables effective thermal management within space-constrained electronic devices by ensuring consistent thermal coupling and preventing component damage from excessive pressure, thus maintaining efficient operation of heat-generating components.
Implementation Method 1
the heat sink may be either in direct contact with an outer surface of the heat generating component, or in indirect contact through an intermediate thermally conductive layer
Implementation Method 2
one or more spring clips are typically used to mount the heat sink to the circuit substrate such that the spring clip biases the heat sink toward the heat generating component with a desired force
Data Source
AI summary
A thermal management device for a circuit substrate having at least a first heat generating component and at least a second heat generating component, the thermal management device includes a first thermal spreader and a second thermal spreader. The second thermal spreader is mountable to the circuit substrate to thermally couple with the second heat generating component. Additionally, the second thermal spreader is adapted to couple to the first thermal spreader to thermally couple the first thermal spreader to the first heat generating component when the second thermal spreader is mounted to the circuit substrate. The thermal management device also includes a bias device that is coupled to the first thermal spreader and the second thermal spreader and is adapted to maintain the thermal coupling between the first thermal spreader and the first heat generating component when the second thermal spreader is mounted to the circuit substrate.