Thermal Dissipation Blocks in Fan-Out Packages for Dense I/O
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Solution Overview
Problem
The increasing miniaturization and functional integration of semiconductor chips lead to challenges in packaging, particularly in managing heat dissipation and I/O pad density, which affects yield and efficiency.
Innovation Solution
Incorporation of thermal dissipation blocks formed simultaneously with redistribution lines, using metal layers interconnected via vias, and electrically isolated thermal dissipation connectors to manage heat dissipation while maintaining electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If I/O pad density is increased to accommodate more functions in smaller areas, then functional integration is improved, but packaging difficulty increases and yield decreases
Solution Approach 1:
The patent implements fan-out packaging technology that redistributes I/O pads from the die surface to a larger area on the package substrate. This dimensional expansion allows the same number of I/O pads to be accommodated with greater spacing, reducing packaging difficulty and improving yield while maintaining high functional integration
2Adaptability or versatility
If more functions are integrated into smaller semiconductor dies, then device functionality is improved, but heat dissipation becomes more difficult
Solution Approach 1:
The patent extracts the thermal management function from the traditional packaging structure by introducing dedicated thermal dissipation blocks and heat sinks. These specialized components are integrated into the package substrate to actively remove heat from high-density functional areas, enabling continued miniaturization and functional integration without thermal penalties
3Temperature
If thermal dissipation blocks are added to manage heat, then temperature control is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple functions into unified structures: thermal dissipation blocks are formed simultaneously with redistribution lines using the same metal layers and via processes, and electrical connectors are designed to provide both electrical connectivity and thermal conduction pathways. This integration reduces overall package complexity while maintaining effective temperature control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Efficient heat dissipation from heat-generating elements reduces temperatures by up to 10°C, improving packaging efficiency and yield by isolating thermal dissipation elements from electrical signal routing.
Implementation Method 1
a first package component includes a thermal dissipation block comprising thermal dissipation elements located close to a heat-generating element
Implementation Method 2
the thermal dissipation connectors facilitate additional heat dissipation from the thermal dissipation block, such as into and through the second package component
Data Source
AI summary
A method of forming a semiconductor device includes forming a first interconnect structure over a carrier; forming a thermal dissipation block over the carrier; forming metal posts over the first interconnect structure; attaching a first integrated circuit die over the first interconnect structure and the thermal dissipation block; removing the carrier; attaching a semiconductor package to the first interconnect structure and the thermal dissipation block using first electrical connectors and thermal dissipation connectors; and forming external electrical connectors, the external electrical connectors being configured to transmit each external electrical connection into the semiconductor device, the thermal dissipation block being electrically isolated from each external electrical connection.