Thermal Bonding Sheet Composition Stability
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Solution Overview
Problem
The paste material containing sinterable metallic particles with a volatile dispersion medium experiences composition deviations during application, leading to nonuniform sintered bodies due to volatilization, which affects the heat characteristics and reliability of semiconductor devices.
Innovation Solution
A thermal bonding sheet with a precursor layer containing a thermally decomposable binder, such as polycarbonate or acrylic resin, and 1,6-hexanediol, which maintains shape and flexibility, and has a controlled weight reduction rate to stabilize the sintered layer formation, integrated with a dicing tape for uniform bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a volatile dispersion medium is used in paste material containing sinterable metallic particles, then sintering between particles can proceed without inhibition, but the dispersion medium volatilizes during application causing composition nonuniformity
Solution Approach 1:
The patent changes the physical state parameter of the dispersion medium from volatile (liquid) to non-volatile (solid) form. The solid dispersion medium does not volatilize during application, maintaining composition uniformity while still allowing sintering to proceed effectively.
Solution Approach 2:
The patent uses a solid dispersion medium that can be easily replaced or removed after serving its purpose of maintaining paste form during storage and application, without causing composition deviations.
2Shape
If a solid thermally decomposable binder is used in the precursor layer, then the sheet maintains shape and flexibility before heating, but the binder must be thermally decomposed during sintering
Solution Approach 1:
The patent utilizes phase transition of the binder from solid state (providing shape maintenance) to decomposed state (allowing sintering). The solid binder maintains sheet integrity during handling, then thermally decomposes during sintering to enable particle bonding.
Solution Approach 2:
The solid thermally decomposable binder acts as an intermediary that temporarily holds the sheet together in solid form, then decomposes to allow the sintering process to proceed without inhibition.
3Stability of the object's composition
If the paste material composition changes during application due to volatilization, then the sintered body becomes nonuniform, but using a non-volatile material prevents composition change
Solution Approach 1:
The patent changes the volatility parameter of the dispersion medium from high (volatile) to low (non-volatile). This prevents composition changes during application while ensuring the material still performs its function of maintaining paste form and enabling sintering.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures stable formation of a sintered layer with desired characteristics, enhancing heat resistance and bonding reliability in semiconductor devices by maintaining composition uniformity and adhesion, while the dicing tape integration simplifies the bonding process and prevents uneven thickness.
Implementation Method 1
a precursor layer that is to become a sintered layer by heating, wherein the precursor layer contains a thermally decomposable binder
Implementation Method 2
the dispersion medium is volatilized as a paste application step proceeds
Implementation Method 3
a paste material containing sinterable metallic particles has been proposed... sintering between particles progresses
Data Source
Figure 1~2
Figure 3~4
AI summary
Provide are a thermal bonding sheet which can suppress a change in composition and stably provide a sintered layer having desired characteristics, and a thermal bonding sheet with dicing tape including the thermal bonding sheet. A thermal bonding sheet has a precursor layer that is to become a sintered layer by heating, wherein a weight reduction rate ΔW0 (%) when the thermal bonding sheet is analyzed in a nitrogen atmosphere at a temperature increase rate of 10°C/min from 23°C to 400°C with a differential thermal balance before the thermal bonding sheet is exposed to an atmosphere having a temperature of 23 ± 2°C and a humidity of 50 ± 20%, and a weight reduction rate ΔW24 (%) when the thermal bonding sheet is analyzed in a nitrogen atmosphere at a temperature increase rate of 10°C/min from 23°C to 400°C with a differential thermal balance after the thermal bonding sheet is exposed to an atmosphere having a temperature of 23 ± 2°C and a humidity of 50 ± 20% for 24 hours, satisfy a relationship of a formula (3) below, −1%≤ΔW0−ΔW24≤0.5%