Thermal Compression Bonding for Long Adhesive Sheet Stacks

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Solution Overview

Problem

Existing image forming systems struggle to create sheet stacks longer than the heat generation area of the heater, necessitating a solution for proper heating and pressing of adhesive layers across the entire sheet stack.

Innovation Solution

An image forming system with a sheet processing apparatus that includes a stacking unit, a moving unit, and a thermal compression bonding unit with an elongated heating member and a sheet cradle member, allowing for selective positioning of the adhesive layer and repeated heating and pressing to cover the entire adhesive area, even if it exceeds the heat generation area of the heater.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of moving object

If a heater with a fixed heat generation area is used to bond sheets, then the heating and pressing process is simple, but the sheet stack length is limited to the heat generation area length

Engineering Contradiction:
Improvesheet stack lengthVSAvoidthermal compression bonding unit complexity
Core Design Contradiction:
Length of moving objectVSDevice complexity

Solution Approach 1:

The patent makes the thermal compression bonding unit movable along the longer-side direction of the heating member. The moving unit enables the thermal compression bonding unit to reposition relative to the adhesive layer, allowing multiple heating and pressing operations on different sections of the adhesive layer. This dynamic capability resolves the contradiction by enabling sheet stack lengths exceeding the heater's fixed heat generation area while managing device complexity through controlled movement.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent divides the bonding process into multiple segments by performing heating and pressing operations on different sections of the adhesive layer sequentially. The moving unit positions the thermal compression bonding unit at different locations along the adhesive layer, effectively segmenting the overall bonding task into manageable portions that can be processed within the heater's limited heat generation area.

Inventive Principle:
Principle #1Segmentation

2Manufacturing precision

If the adhesive layer length exceeds the heat generation area, then complete coverage bonding is difficult to achieve, but extending the heater increases device complexity

Engineering Contradiction:
Improveadhesive bonding coverageVSAvoidheating system complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

Instead of extending the static heater, the patent employs a dynamic solution where the thermal compression bonding unit moves along the adhesive layer. This allows the fixed heat generation area to cover the entire adhesive layer over time through multiple positioned operations, achieving complete coverage bonding without increasing heater size or complexity.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The moving unit pre-positions the thermal compression bonding unit at specific locations along the adhesive layer before each heating and pressing operation. This preliminary positioning ensures that each section of the adhesive layer receives appropriate heat and pressure in sequence, achieving complete coverage without requiring the heater to be as long as the entire adhesive layer.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables the creation of sheet stacks by effectively heating and pressing the adhesive layer across its entire length, ensuring thorough bonding regardless of the heater's coverage limitations.

Implementation Method 1

a thermal compression bonding unit having a heating member that is elongated and a sheet cradle member that faces the heating member... the thermal compression bonding unit is configured to sandwich and heat the plural sheets stacked on the stacking unit between the heating member and the sheet cradle member

Methodology Applied
Scientific EffectThermal compression bonding: Heating

Data Source

PatentUS12485694B2Image forming system and sheet processing apparatus
Publication Date: 2025.12.02 CANON KK
  • US12485694B2 patent drawing
  • US12485694B2 patent drawing
  • US12485694B2 patent drawing

AI summary

An image forming system includes an image forming apparatus and a sheet processing apparatus having a stacking unit, a moving unit, and a thermal compression bonding unit. The stacking unit includes a stack of plural sheet having an adhesive layer for bonding the plural sheets together. The thermal compression bonding unit includes a heating member having a heat generation area. In a case where a length of the adhesive layer regarding a longer-side direction of the heating member is greater than a length of the heat generation area, an entire area of the adhesive layer on the plural sheets is heated and pressed by applying heat and pressure to the adhesive layer more than once while changing, via the moving unit, a relative position of the plural sheets having been conveyed onto the stacking unit and the heat generation area regarding the longer-side direction of the heating member.