Thermally Conductive Bracket for Head-Mounted Device Heat and EMI Management
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Solution Overview
Problem
Head-mountable devices face challenges in effectively managing heat dissipation and maintaining a dust-free environment for sensitive electronic components like cameras, which are also prone to electromagnetic interference due to their metal bodies acting as antennas, leading to performance degradation and interference with other components.
Innovation Solution
The implementation of a thermally conductive bracket assembly that provides relative motion to electronic circuits, allowing for efficient heat dissipation through conduction while maintaining a sealed chamber to prevent debris ingress and ensuring electrical grounding to minimize noise interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic circuits are enclosed in a sealed chamber to prevent debris ingress, then reliability is improved, but heat dissipation becomes difficult
Solution Approach 1:
The patent employs a sealed chamber with a flexible membrane or thin film structure that allows thermal conduction while maintaining the seal. The thin film acts as a thermal pathway for heat dissipation while preventing debris ingress, resolving the contradiction between sealing and heat management.
Solution Approach 2:
The patent introduces a thermal interface material or intermediary substance between the electronic circuit and the sealed chamber wall. This intermediary facilitates heat transfer from the circuit to the chamber while the chamber maintains its sealed protective environment, allowing both heat dissipation and debris protection.
2Reliability
If metal brackets are used for structural support and grounding, then electrical grounding is improved, but electromagnetic interference increases due to metal acting as antennas
Solution Approach 1:
The patent uses composite materials for the bracket assembly, combining conductive materials for grounding with non-conductive or electromagnetic-shielding materials. This composite structure provides the necessary electrical grounding path while minimizing antenna effects and electromagnetic interference through the non-conductive portions or shielding layers.
Solution Approach 2:
The patent segments the bracket into different functional zones: conductive portions for grounding and non-conductive or shielded portions for structural support. This segmentation allows the grounding function to be performed in specific areas while other areas minimize electromagnetic radiation, resolving the contradiction between grounding and EMI.
3Stability of the object's composition
If electronic circuits are fixed rigidly to the chassis, then structural stability is improved, but heat dissipation efficiency decreases
Solution Approach 1:
The patent transitions from rigid fixed mounting to a dynamic mounting system that allows thermal expansion and contraction. The electronic circuit is mounted on a bracket with controlled compliance or flexibility, enabling the structure to adapt to thermal changes while maintaining stable electrical and thermal contact for effective heat dissipation.
Solution Approach 2:
The patent changes the mechanical parameters of the mounting system, using materials or structures with specific thermal expansion coefficients that match between components. This parameter matching allows thermal expansion during operation without creating stress or compromising the thermal contact, maintaining both structural stability and heat dissipation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables optimal operation of electronic circuits in head-mountable devices by effectively managing heat, preventing degradation, and reducing electromagnetic interference, thus enhancing the overall performance and longevity of the components.
Implementation Method 1
The implementation of a thermally conductive bracket assembly that provides relative motion to electronic circuits, allowing for efficient heat dissipation through conduction
Implementation Method 2
an elastic member positioned between the first chassis portion and the second chassis portion
Data Source
AI summary
A head-mountable device (100) can include electronic circuits, such as cameras (150, 350, 450), sensors (170), and input/output devices. The head-mountable device can secure such electronic circuits with an assembly that also provides thermal dissipation, electrical grounding, and a sealed chamber (312, 412) to isolate the electronic circuit from ingress of debris. The assembly can provide a degree of mobility, where desired. Accordingly, the electronic circuit can operate more optimally and with lower risk of degradation and interference with other components of the head-mountable device.