Thermal Break in Substrate Support for Uniform Processing

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Solution Overview

Problem

In substrate processing systems, temperature differentials between the edge ring and dielectric plate cause non-uniform chemical reactions and process drift due to varying RF powers and ion bombardment, leading to tilted equipotential lines and inefficient processing.

Innovation Solution

A substrate support system with a ceramic plate, a ceramic ring, and a cooling plate, where the ceramic ring and plate are thermally isolated to provide independent temperature control, using a heating element and separate coolant channels to maintain consistent processing conditions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If the edge ring and dielectric plate are thermally coupled, then structural simplicity is maintained, but temperature differentials cause non-uniform chemical reactions and process drift

Engineering Contradiction:

Improvestructural simplicityVSAvoidprocess uniformity

Core Design Contradiction:

Device complexityVSManufacturing precision

Solution Approach 1:

The cooling plate is segmented into a first cooling plate portion coupled to the dielectric plate and a second cooling plate portion coupled to the edge ring, with a thermal break between them. This segmentation allows independent temperature control of the dielectric plate and edge ring, preventing temperature differentials that cause non-uniform chemical reactions and process drift, while maintaining overall structural simplicity.

Inventive Principle:

Principle #1Segmentation

2Reliability

If RF power is applied to create bias voltage, then ion attraction to substrate is improved, but equipotential lines become tilted proximate the edge ring causing process drift

Engineering Contradiction:

Improveion attraction efficiencyVSAvoidprocess stability

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The system applies different thermal conditions to different regions: the dielectric plate region maintains one temperature for optimal ion attraction, while the edge ring region maintains a different temperature to prevent sheath bending. This local quality differentiation ensures reliable ion attraction to the substrate while maintaining process stability by preventing equipotential line tilting near the edge ring.

Inventive Principle:

Principle #3Local quality

3Adaptability or versatility

If the ceramic ring is thermally isolated from the ceramic plate, then independent temperature control is achieved, but device complexity increases

Engineering Contradiction:

Improveindependent temperature controlVSAvoidthermal isolation structure

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

A thermal break acts as an intermediary element between the first cooling plate portion and the second cooling plate portion. This thermal break enables independent temperature control of the ceramic plate and ceramic ring by preventing direct thermal coupling, while adding minimal structural complexity compared to fully isolated designs.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution ensures uniform chemical reactions and stable processing by allowing independent temperature control of the ceramic ring and plate, reducing process drift and maintaining consistent substrate processing conditions.

Implementation Method 1

the ceramic ring includes a chucking electrode and a heating element embedded in the ceramic ring

Methodology Applied

Scientific EffectJoule heating: Joule Heating

Implementation Method 2

a cooling plate coupled to the second side of the ceramic plate and the second side of the ceramic ring

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

a cooling plate having first coolant channels disposed in a radially inner portion and second coolant channels disposed in a radially outer portion

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 4

An electrostatic chuck is used to electrostatically hold a substrate to control substrate temperature during processing

Methodology Applied

Scientific EffectElectrostatic force: Electrostatics

Implementation Method 5

RF power can be used for plasma generation and/or for creating bias voltage on a substrate being processed to attract ions from bulk plasma

Methodology Applied

Scientific EffectPlasma generation: Plasma

Data Source

PatentUS11551916B2Sheath and temperature control of a process kit in a substrate processing chamber

Publication Date: 2023.01.10 APPLIED MATERIALS INC

AI summary

Embodiments of substrate supports are provided herein. In some embodiments, a substrate support for use in a substrate processing chamber includes a ceramic plate having a first side configured to support a substrate and a second side opposite the first side, wherein the ceramic plate includes an electrode embedded in the ceramic plate; a ceramic ring disposed about the ceramic plate and having a first side and a second side opposite the first side, wherein the ceramic ring includes a chucking electrode and a heating element embedded in the ceramic ring; and a cooling plate coupled to the second side of the ceramic plate and the second side of the ceramic ring, wherein the cooling plate includes a radially inner portion, a radially outer portion, and a thermal break disposed therebetween.