Thermal Bridge Structure With Additive Heat-Contact Layer
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Solution Overview
Problem
Conventional thermal bridges face inefficiencies in heat transfer due to microscopic contamination at joining surfaces, leading to increased thermal resistance and reduced conductivity, especially after separate production and handling of components.
Innovation Solution
A thermal bridge design featuring a heat release section and a heat absorption section connected via a material-locking mechanism, where the heat absorption section is built using additive melt layering with a second material component that can be molded by contact pressure, improving thermal conductivity and reducing thermal resistance by displacing air and accommodating different thermal expansion rates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional joining methods are used to assemble thermal bridge components, then manufacturing flexibility and ease of assembly are improved, but thermal conductivity at interfaces deteriorates due to microscopic contamination and air layers
Solution Approach 1:
The patent merges the heat absorption section and heat release section into a single integrally formed thermal bridge component using additive manufacturing. This eliminates the interface between separate components, thereby removing the thermal resistance caused by microscopic contamination and air layers at joining surfaces, while maintaining manufacturing flexibility through additive process
Solution Approach 2:
The patent introduces a TIM (thermal interface material) layer as an intermediary substance within the integrally formed structure. This TIM layer fills the space between the heat absorption section and heat release section, displacing air and providing a thermally conductive path that bridges the thermal gap, thereby improving thermal conductivity without requiring separate joining operations
2Adaptability or versatility
If multiple interfaces are introduced to improve manufacturing flexibility, then adaptability to different heat sources is improved, but thermal resistance increases due to additional joining surfaces
Solution Approach 1:
The patent combines multiple functional sections (heat absorption section, heat release section, and TIM layer) into a single integrally formed component. This merging approach maintains adaptability to different heat sources through the modular functional design while eliminating the thermal resistance that would result from multiple separate interfaces and joining operations
Solution Approach 2:
The patent applies local quality by providing different material properties in different sections of the thermal bridge. The heat absorption section, TIM layer, and heat release section each have optimized local properties suitable for their specific function, allowing adaptability to various heat sources while maintaining low thermal resistance through the continuous material structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the thermal conductivity of the thermal bridge by minimizing air inclusions and mechanical stresses, maintaining efficiency across multiple thermal cycles and allowing for flexible integration with various heat sources and installation positions.
Implementation Method 1
from the joining surface up to the heat contact surface, a second material component of the thermal bridge built up by additive melt layering
Implementation Method 2
the heat absorption section is configured to absorb the heat at the heat contact surface and to transport the heat in a heat-conducting manner via the material-locking connection from the heat absorption section to the heat release portion
Implementation Method 3
the heat release portion is configured to release heat from the joining surface to the heat release surface in a thermally conductive manner
Data Source
AI summary
A thermal bridge for a thermally conductive transport of heat includes: a heat release portion having: a joining surface; a heat release surface spaced from the joining surface; and a first material component of the thermal bridge from the joining surface to the heat release surface. The heat release portion releases heat from the joining surface to the heat release surface in a thermally conductive manner and releases the heat at the heat release surface. The thermal bridge includes a heat absorption section connected to the heat release section at the joining surface in a material-locking manner as a material-locking connection, the heat absorption section including: a heat contact surface moldable by contact pressure; and from the joining surface up to the heat contact surface, a second material component of the thermal bridge built up by additive melt layering, the second material component being different from the first material component.