Thermal Bridge With Spring-Biased Plate Stack
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Solution Overview
Problem
Existing thermal management systems for electrical components face inefficiencies in heat dissipation due to limited thermal interface areas and variations in surface flatness, leading to reduced performance and potential component damage.
Innovation Solution
A thermal bridge assembly comprising a stack of upper and lower plates with a spring element and bridge frame, allowing for compressible and conformable thermal coupling between electrical components and heat transfer devices, enhancing heat dissipation by increasing usable surface area and accommodating variations in component shapes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional heat sinks are used with fixed thermal interfaces, then the structure is simple, but the thermal coupling efficiency is reduced due to limited interface area and surface flatness variations
Solution Approach 1:
The thermal interface is segmented into multiple flexible plates (first plate, second plate, third plate, fourth plate) arranged in a stacked configuration. Each plate can independently deform to conform to surface variations, collectively increasing the effective thermal interface area and improving coupling efficiency without requiring a complex single-structure heat sink.
Solution Approach 2:
The thermal interface structure transitions from a fixed rigid connection to a dynamic flexible plate system. The flexible plates can deform and adapt their shape in response to surface variations and applied pressure, maintaining optimal thermal contact across irregular surfaces and improving coupling efficiency under varying operational conditions.
2Adaptability or versatility
If rigid thermal interfaces are used, then the manufacturing is simple, but the adaptability to component shape variations is poor
Solution Approach 1:
Flexible plates are used as the thermal interface medium instead of rigid interfaces. These flexible plates can bend and deform to match the contours of varying component surfaces, providing excellent adaptability to shape variations while maintaining a relatively simple manufacturing process using standard flexible materials and lamination techniques.
3Area of stationary object
If larger thermal interface area is achieved through rigid structures, then the manufacturing precision requirements increase due to surface flatness constraints
Solution Approach 1:
The system changes the physical state and mechanical properties of the thermal interface materials by using flexible plates that can deform under applied pressure. This allows the interface area to be effectively increased without requiring high surface flatness, as the flexible plates conform to surface variations through elastic deformation rather than relying on precision machining of rigid surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermal bridge assembly effectively transfers heat away from electrical components, improving system performance and preventing damage by enhancing thermal interface efficiency and adaptability.
Implementation Method 1
The spring element includes an upper spring member engaging the upper plates to bias the upper plates with an opening force generally away from the lower plates. The spring element includes a lower spring member engaging the lower plates to bias the lower plates with an opening force generally away from the upper plates.
Implementation Method 2
The outer ends of the lower plates are configured to face and thermally couple to an electrical component. The sides of the lower plates face the sides of the upper plates to thermally interface the lower plates with the upper plates.
Data Source
AI summary
A thermal bridge includes an upper bridge assembly including upper plates arranged in an upper plate stack and a lower bridge assembly including lower plates arranged in a lower plate stack. Outer ends of the lower plates face and thermally couple to an electrical component. The upper plates and the lower plates are arranged in plate pairs. A spring element forces the upper plates and the lower plates of the plate pairs apart. The upper plates include upper limit tabs and the lower plates include lower limit tabs. The upper limit tabs and the lower limit tabs operate to limit spreading apart of the upper plates and the lower plates against the opening forces of the spring element.