Thermal Bridge for Electrical Components Using Stacked Plates
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Solution Overview
Problem
Existing thermal management systems for electrical components face inefficiencies in heat dissipation due to limited thermal interface areas and variations in surface flatness, leading to degraded performance and potential damage from thermal energy buildup.
Innovation Solution
A thermal bridge assembly comprising upper and lower plate stacks with a spring element and internal bridge frame, allowing for compressible and conformable thermal interfaces between electrical components and heat transfer devices, enhancing heat dissipation by increasing usable surface area and maintaining efficient thermal coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat sink is used to transfer thermal energy away from electrical components, then heat dissipation is improved, but thermal interface efficiency deteriorates due to limited thermal interface areas and surface flatness variations
Solution Approach 1:
The thermal bridge is segmented into multiple plates (first plate, second plate, third plate, fourth plate) arranged in a stacked configuration. This segmentation increases the thermal interface area between the thermal bridge and both the electrical component and heat sink, thereby improving thermal coupling efficiency while maintaining effective heat dissipation
Solution Approach 2:
The patent transitions from a traditional single-plate thermal bridge to a multi-plate stacked structure, adding a vertical dimension to the thermal interface. This dimensional change creates multiple thermal contact surfaces, effectively increasing the thermal interface area without expanding the horizontal footprint
2Manufacturing precision
If rigid thermal bridge structures are used, then manufacturing precision is improved, but adaptability deteriorates due to inability to accommodate variations in component and heat transfer device shapes
Solution Approach 1:
The thermal bridge incorporates elastic members that enable the structure to dynamically adjust and conform to varying geometries of electrical components and heat sinks. This dynamic capability allows the rigid multi-plate structure to adapt its shape while maintaining manufacturing precision and structural integrity
Solution Approach 2:
The patent utilizes materials with specific elastic properties that allow the thermal bridge plates to change their physical parameters (flexibility, conformability) when subjected to thermal and mechanical loads, enabling adaptation to different component shapes while maintaining structural stability
3Temperature
If multiple thermal interfaces are created in series, then heat dissipation capability is improved, but thermal efficiency deteriorates due to efficiency loss at each interface
Solution Approach 1:
The multiple thermal plates are thermally coupled in a series configuration where each plate is in direct thermal contact with the next, merging the thermal conduction paths. This combining approach allows heat to flow efficiently through the entire stack while minimizing thermal resistance at interfaces through optimized contact surfaces
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermal bridge assembly effectively transfers heat away from electrical components, improving system performance and preventing damage by increasing the efficiency of thermal interfaces and accommodating variations in component and heat transfer device shapes.
Implementation Method 1
a spring element positioned between the upper bridge assembly and the lower bridge assembly. The spring element includes an upper spring member engaging the upper plates to bias the upper plates in a first biasing direction generally away from the lower plates
Implementation Method 2
The lower plates are configured to face and thermally couple to an electrical component. The sides of the lower plates face the sides of the upper plates to thermally interface the lower plates with the upper plates
Data Source
AI summary
A thermal bridge includes upper and lower bridge assemblies including upper and lower plates arranged in stacks. Sides of the plates face each other to thermally interface the lower plates with the upper plates. The thermal bridge includes a spring element positioned between the upper bridge assembly and the lower bridge assembly. The thermal bridge includes an internal bridge frame having connecting elements that extend internally through the upper plates and the lower plates to hold the upper plates in the upper plate stack and to hold the lower plates in the lower plate stack.