Thermal Buffer Cooling Loop for Stable Compressor Cycling
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Solution Overview
Problem
The increasing power dissipation of integrated circuit chips poses a cooling challenge in data centers, as traditional air-cooling methods become inadequate for managing heat loads in high-performance server systems, leading to temperature fluctuations and potential system instability.
Innovation Solution
A coolant-cooled structure with a thermal buffer unit, a coolant-to-refrigerant heat exchanger, and a compressor system that cycles based on the electronic component's heat load, ensuring efficient heat dissipation and temperature stabilization by using a coolant loop and refrigerant loop in conjunction with a compressor that adjusts its operation in response to heat load thresholds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If air-cooling methods are used to cool electronic components, then the system structure is simple and ease of manufacture is improved, but cooling efficiency deteriorates and temperature control stability worsens under high power dissipation conditions
Solution Approach 1:
The patent introduces a coolant as an intermediary substance between the electronic component and the thermal buffer unit. The coolant circulates through channels in the coolant-cooled structure, absorbing heat from the electronic component and transporting it to the thermal buffer unit for storage or dissipation. This intermediary coolant system enables more effective heat removal compared to direct air-cooling, improving temperature control stability while maintaining manufacturing simplicity.
Solution Approach 2:
The patent employs phase change material (PCM) in the thermal buffer unit that undergoes phase transition (typically from solid to liquid) to absorb and store thermal energy. When the electronic component generates heat, the coolant transports it to the PCM, which absorbs the heat during melting. This phase transition mechanism provides passive thermal regulation, stabilizing temperature without complex control systems, thus improving reliability while keeping the system manufacturable.
2Use of energy by moving object
If compressor is cycled ON and OFF based on heat load threshold, then energy efficiency is improved, but temperature stability deteriorates due to thermal swings during cycling
Solution Approach 1:
The patent implements a thermal buffer unit containing phase change material (PCM) that acts as a thermal cushion before temperature swings occur. When the compressor shuts off to save energy, the PCM releases stored thermal energy gradually, cushioning against rapid temperature increases in the coolant. This beforehand cushioning allows the compressor to cycle ON and OFF for energy efficiency while maintaining coolant temperature stability during the OFF periods.
Solution Approach 2:
The thermal buffer unit utilizes phase change material that transitions between solid and liquid states to buffer temperature variations. During compressor ON periods, excess heat causes PCM to melt, absorbing thermal energy. During compressor OFF periods, the PCM releases this stored energy as it remains in liquid state or begins to freeze, preventing rapid temperature drops. This phase transition mechanism enables energy-efficient compressor cycling while maintaining temperature stability.
3Stability of the object's composition
If thermal buffer unit with phase change material is added to the coolant loop, then temperature stability is improved during compressor cycling, but device complexity increases
Solution Approach 1:
The patent merges the thermal buffer unit directly into the existing coolant loop structure, integrating the phase change material containment within the coolant circulation system. The thermal buffer unit is positioned in series within the coolant loop, allowing coolant to flow through it naturally without requiring separate circulation systems. This merging approach adds thermal buffering capability while minimizing additional complexity in the coolant loop structure.
Solution Approach 2:
The thermal buffer unit containing phase change material provides self-regulating thermal buffering without requiring external control systems, sensors, or active components. The PCM automatically absorbs or releases thermal energy based on temperature conditions, providing passive temperature stabilization. This self-service mechanism improves temperature stability without adding complex control logic or monitoring systems to the coolant loop, thereby limiting the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively manages heat dissipation and maintains temperature stability within specified ranges, reducing the risk of system failure and improving the reliability of high-performance server systems by ensuring continuous cooling performance even during fluctuations in heat load.
Implementation Method 1
The coolant-to-refrigerant heat exchanger cools coolant passing therethrough by dissipating heat from the coolant passing therethrough to refrigerant passing therethrough
Implementation Method 2
the thermal storage unit dampens swings in temperature of coolant within the coolant loop during cycling ON and OFF of the compressor
Data Source
AI summary
Apparatus and method are provided for cooling an electronic component(s). The apparatus includes a coolant-cooled structure in thermal communication with the component(s) to be cooled, and a coolant-to-refrigerant heat exchanger in fluid communication with the coolant-cooled structure via a coolant loop. A thermal buffer unit is coupled in fluid communication with the coolant loop, and a refrigerant loop is coupled in fluid communication with the heat exchanger. The heat exchanger dissipates heat from coolant in the coolant loop to refrigerant in the refrigerant loop. A compressor is coupled in fluid communication with the refrigerant loop and is maintained ON responsive to heat load of the component(s) exceeding a heat load threshold, and is cycled ON and OFF responsive to heat load of the component(s) being below the threshold. The thermal storage unit dampens swings in coolant temperature within the coolant loop during cycling ON and OFF of the compressor.