Thermal Buffering Element for Uniform Heat Distribution
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Solution Overview
Problem
Conventional heat dissipating elements in electronic devices, such as fans, heat fins, and heat pipes, are difficult to miniaturize, limiting the thickness reduction of electronic products and failing to provide uniform heat distribution and temperature management, which affects user comfort and device performance.
Innovation Solution
A thermal buffering element comprising a heat absorbing material and metal particles, with optional thermal diffusion materials, that stores heat and enhances heat transfer, allowing for even temperature distribution and reduced temperature fluctuations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat dissipating elements (fan, heat fin, heat pipe) are used, then heat dissipation function is provided, but the thickness of electronic product cannot be reduced
Solution Approach 1:
The patent changes the physical state and thermal properties of the heat dissipating material by using phase change materials (paraffin) combined with metal particles. This transformation from conventional solid heat fins to a phase-change-based thermal buffering element enables thinner design while maintaining heat dissipation capability through latent heat absorption during phase transition.
Solution Approach 2:
The patent employs a composite material structure consisting of heat absorbing material (paraffin) and metal particles distributed within it. This composite combines the high latent heat storage capacity of phase change materials with the high thermal conductivity of metal particles, achieving both heat storage and efficient heat transfer in a thin configuration.
2Temperature
If thin heat conducting sheet or heat dissipating fin is attached to heat source, then heat transfer path is provided, but heat cannot be stored and temperature cannot be maintained
Solution Approach 1:
The patent utilizes the phase transition properties of paraffin (heat absorbing material) which can absorb and store large amounts of heat during melting phase change. This phase transition mechanism enables the thin heat buffering element to store heat effectively, maintaining temperature stability without requiring substantial material quantity.
3Temperature
If conventional heat conducting sheet or heat dissipating fin is used, then heat transfer is provided, but heat distribution uniformity is limited and user comfort is affected
Solution Approach 1:
The patent modifies the thermal properties by incorporating metal particles within the phase change material matrix, creating a composite with enhanced thermal conductivity. This parameter change in heat conduction capability enables more uniform heat distribution across the heat buffering element, preventing hot spots and improving overall thermal management performance for user comfort.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermal buffering element effectively manages temperature distribution within electronic devices, extending component lifespan and user comfort by storing and evenly spreading heat, while allowing for thinner device designs and flexible space utilization.
Implementation Method 1
the heat absorbing material stores heat
Implementation Method 2
the metal particles can improve the heat transferring speed of the thermal buffering element
Data Source
AI summary
A thermal buffering element applied to an electronic device is provided. The thermal buffering element includes a heat absorbing material and a plurality of metal particles. The heat absorbing material is disposed corresponding to a heat source of the electronic device. The metal particles are distributed in the heat absorbing material. The invention solves the problem of uneven heat dissipation of an electronic product, which makes a user feel more comfortable.