Thermal Bus Structure for MRI Shield Temperature Control

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Solution Overview

Problem

Conventional electromagnetic shields in magnetic resonance imaging devices suffer from temperature variations due to varying eddy currents, leading to imaging artifacts and reduced efficiency of the main magnetic field.

Innovation Solution

A magnetic resonance imaging device with a thermal bus structure and spaced shield elements, connected to a cryocooler, that dynamically adjusts heat transfer properties to equalize eddy currents and maintain consistent temperatures across the shield elements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If conventional electromagnetic shields are used to block magnetic stray fields, then electromagnetic shielding is improved, but temperature variations occur due to varying eddy currents causing imaging artifacts

Engineering Contradiction:
Improveelectromagnetic shieldingVSAvoidtemperature uniformity
Core Design Contradiction:
Object-affected harmful factorsVSTemperature

Solution Approach 1:

The electromagnetic shield is divided into multiple discrete shield elements spaced apart from each other. This segmentation allows each element to independently respond to magnetic stray fields, reducing the propagation of temperature variations through the shield structure while maintaining effective electromagnetic shielding.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the shield are designed with varying properties - the shield elements are positioned at specific locations and orientations to locally counteract magnetic stray field effects. This local optimization reduces eddy current variations in critical areas while maintaining overall shielding effectiveness.

Inventive Principle:
Principle #3Local quality

2Area of stationary object

If the electromagnetic shield is separated into disjoint structures to reduce footprint, then device compactness is improved, but temperature variations increase causing imaging artifacts

Engineering Contradiction:
Improveshield footprintVSAvoidtemperature consistency
Core Design Contradiction:
Area of stationary objectVSManufacturing precision

Solution Approach 1:

The shield is segmented into multiple discrete elements distributed in space rather than a single continuous structure. This segmentation reduces the overall footprint while maintaining temperature consistency through strategic placement of thermal management components and careful design of thermal pathways between elements.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Thermal bus structures act as intermediaries connecting the shield elements to the cryocooler system. These thermal pathways ensure uniform temperature distribution across the dispersed shield elements, preventing temperature variations that would otherwise arise from the disjointed structure.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Object-affected harmful factors

If active electromagnetic shields are used to decrease magnetic stray field impact, then electromagnetic shielding is improved, but additional space and cooling requirements increase distance from main magnet

Engineering Contradiction:
Improvemagnetic stray field shieldingVSAvoiddistance from main magnet
Core Design Contradiction:
Object-affected harmful factorsVSLength of stationary object

Solution Approach 1:

The shield elements are designed to passively respond to magnetic stray fields through their inherent electromagnetic properties. The spacing and configuration of elements allow them to automatically counteract stray field effects without requiring active control systems or additional cooling infrastructure, thereby minimizing the distance from the main magnet.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Reduces imaging artifacts and maintains efficient main magnetic field generation by minimizing temperature variations and superimposed eddy fields, enhancing image quality.

Implementation Method 1

a thermal bus structure (31) thermally connecting the shield elements (12i) to a cold head (32a) of the cryocooler (32)

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a cryocooler (32) with a cold head (32a), wherein the thermal bus structure (31) thermally connecting the shield elements (12i) to the cold head (32a) of the cryocooler (32)

Methodology Applied
Scientific EffectCryocooling: Cooling

Implementation Method 3

an electromagnetic shield (12) arranged between the gradient system (19) and the main magnet (17), wherein the electromagnetic shield (12) comprises a plurality of spaced shield elements (12i)

Methodology Applied
Scientific EffectElectromagnetic shielding: Electromagnetic Induction

Data Source

PatentEP4300119B1Thermal bus structure for a magnetic resonance imaging device
Publication Date: 2025.10.29 SIEMENS HEALTHCARE LTD
  • EP4300119B1 patent drawingFigure 1
  • EP4300119B1 patent drawingFigure 2
  • EP4300119B1 patent drawingFigure 3~4

AI summary

The invention relates to a magnetic resonance imaging device (11) comprising a main magnet (17), a gradient system (19) with at least one gradient coil, a cryocooler (32), a thermal bus structure (31) and an electromagnetic shield (12) arranged between the gradient system (19) and the main magnet (17), wherein the electromagnetic shield (12) comprises a plurality of spaced shield elements and wherein the electromagnetic shield (12) is configured to provide an electromagnetic shielding of the main magnet (17) from a magnetic field generated by the at least one gradient coil, wherein the thermal bus structure (31) comprises a plurality of thermal bus elements configured to provide a thermal connection between the plurality of spaced shield elements and a cold head of the cryocooler (32) and wherein at least two thermal bus elements of the plurality of thermal bus elements comprise different heat transfer properties for providing an individualized temperature control of the plurality of spaced shield elements.