Thermal Sensor Calibration Circuit for AC/DC Crosstalk Isolation
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Solution Overview
Problem
Existing thermal electric calibration devices face limitations due to electrical cross talk between direct current (DC) and alternating current (AC) power sources, leading to diminished measurement accuracy and range.
Innovation Solution
A circuit design that electrically decouples reference and device under test (DUT) power sources from measurement sensors, using photonic or RF sensors to detect temperature changes via heating elements, eliminating cross talk and enabling precise calibration by measuring frequency shifts in optical or RF signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If reference and DUT power sources are electrically connected to measurement sensors for direct measurement, then measurement capability is achieved, but electrical cross talk occurs between DC and AC power sources leading to diminished measurement accuracy
Solution Approach 1:
The patent introduces thermal coupling as an intermediary mechanism between power sources and sensors. Heating elements convert electrical power to thermal energy, which then couples to temperature-sensitive sensors (optical ring resonators or RF sensors). This thermal intermediary eliminates direct electrical connections, thereby eliminating electrical cross talk while preserving measurement capability through temperature-mediated signal transfer.
Solution Approach 2:
The patent replaces direct electrical measurement systems with thermal-field-based measurement. Instead of measuring electrical properties directly through electrical connections, the system measures temperature changes induced by power dissipation in heating elements. This substitution of measurement domain (from electrical to thermal) eliminates the harmful electrical cross talk while maintaining measurement functionality.
2Measurement precision
If thermal coupling is used to eliminate electrical cross talk, then measurement accuracy improves, but device complexity increases due to additional heating elements and thermal isolation structures
Solution Approach 1:
The patent merges multiple functions into integrated structures. The heating elements are formed as part of the same semiconductor layer as the optical ring resonators, and the thermal isolation structures are integrated into the device architecture rather than being separate components. This merging reduces overall device complexity while maintaining the thermal coupling mechanism needed for accurate measurements.
Solution Approach 2:
The patent applies thermal isolation selectively only where needed - specifically between adjacent heating elements and between heating elements and unrelated circuitry. The isolation is localized rather than global, using thin insulating layers only in critical regions. This localized approach minimizes the added complexity while ensuring measurement accuracy is not compromised by thermal interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The circuit achieves high precision electrical measurements with low uncertainty, approximately 1 microvolt, by isolating sensors from power sources, allowing for accurate calibration of AC and DC power sources.
Implementation Method 1
A ref1 heating element is adjacent to and electrically isolated from the ref1 sensor and a DUT1 heating element is adjacent to and electrically isolated from the DUT1 sensor. A ref1 power source is connected to the ref1 heating element, and a DUT1 power source is connected to the DUT1 heating element.
Implementation Method 2
A first reference (ref1) optical ring resonator laterally offset from a ref1 waveguide bus where the ref1 waveguide bus has a ref1 input separated from a ref1 output by the ref1 optical ring resonator
Implementation Method 3
A ref1 resistive element surrounds a portion of the ref1 sensor. A ref2 resistive element surrounds a portion of the ref2 sensor. A DUT1 resistive element surrounds a portion of the DUT1 sensor.
Data Source
AI summary
The present disclosure relates to calibration devices for alternating current (AC) and direct current (DC) systems. The calibration device includes a circuit with a first reference (ref1) sensor that has a ref1 input and a ref1 output. The circuit has a first device under test (DUT1) sensor with a DUT1 input and a DUT1 output. The circuit has a coupler, where the ref1 output and the DUT1 output are connected to a first input and a second input of the coupler respectively and the coupler has a coupler output. A ref1 heating element is adjacent to and electrically isolated from the ref1 sensor and a DUT1 heating element is adjacent to and electrically isolated from the DUT1 sensor. A ref1 power source is connected to the ref1 heating element, and a DUT1 power source is connected to the DUT1 heating element.