Thermal Capacitance Element for IC Die Temperature Control
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Solution Overview
Problem
Conventional chip packaging schemes fail to effectively manage high temperatures, leading to erratic functionality or permanent device failure in electronic devices due to IC dies exceeding their rated operating temperature.
Innovation Solution
Incorporating a thermal capacitance element with a container filled with a phase-change material that changes from a solid to a liquid at a target temperature, which stores heat energy to prevent temperature rise in IC dies, thereby extending operational time beyond maximum rated temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional chip packaging schemes are used, then device complexity is reduced and ease of manufacture is improved, but temperature management capability deteriorates leading to IC dies exceeding maximum operating temperature
Solution Approach 1:
The patent employs a phase change material (PCM) that transitions from solid to liquid at a specific temperature range to absorb excess heat from IC dies. The PCM is encapsulated in a container and thermally coupled to the IC die, utilizing the latent heat of fusion to maintain the IC die temperature below maximum operating limits during high-temperature environmental conditions.
Solution Approach 2:
The patent introduces a thermal capacitance element as an intermediary component between the IC die and the external environment. This element includes a phase change material that acts as a thermal buffer, absorbing heat during phase transition and preventing direct heat transfer to the IC die, thereby extending operational time beyond what conventional packaging would allow.
2Duration of action of moving object
If thermal capacitance element with phase change material is added, then temperature management and operational duration are improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The phase change material is pre-encapsulated in a sealed container during the chip packaging process, rather than requiring post-assembly integration. This preliminary preparation simplifies the manufacturing process by allowing the thermal capacitance element to be installed as a single component, reducing assembly complexity despite the added functionality.
Solution Approach 2:
The thermal capacitance element serves multiple functions: it provides structural support within the chip package, acts as a thermal barrier, and functions as a heat sink through phase change. This multi-functionality reduces the need for separate components, thereby mitigating the increase in manufacturing complexity.
3Reliability
If phase change material is used to absorb heat, then temperature rise is prevented, but the material requires precise phase change temperature selection and containment
Solution Approach 1:
The phase change material is selected with a specific melting point tailored to the operational temperature range of the IC die. The material properties are locally optimized for the specific thermal conditions of the application, ensuring reliable temperature control while simplifying the selection process through targeted material specification rather than broad compatibility requirements.
Solution Approach 2:
The phase change material is encapsulated in a sealed container that is designed to be replaced rather than repaired. This approach simplifies manufacturing by using standard sealing techniques and allows for quality control through simple visual inspection of the sealed container, reducing the need for complex precision sealing requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermal capacitance element effectively slows or prevents temperature rise in IC dies, allowing extended operation in high-temperature environments and enhancing device reliability and longevity by maintaining IC dies within safe operating temperatures.
Implementation Method 1
The capacitance material is selected to change from a solid phase to a liquid phase at a target temperature of the thermal capacitance material
Implementation Method 2
The capacitance material is selected to change from a solid phase to a liquid phase at a target temperature... stores heat energy to prevent temperature rise
Implementation Method 3
a thermally conductive object thermally connected to the IC die... a thermal capacitance element thermally connected to the thermally conductive object
Data Source
AI summary
Chip packages and electronic devices are provided that include a thermal capacitance element that improves the operation of IC dies at elevated temperatures. In one example, a chip package is provided that includes an integrated circuit (IC) die, a lid thermally connected to the IC die, and a thermal capacitance element thermally connected to the lid. The thermal capacitance element includes a container and a capacitance material sealingly disposed in the container. The capacitance material has a phase transition temperature that is between 80 and 100 percent of a maximum designed operating temperature in degrees Celsius of the IC die.