Thermal Chamber Absorber Layout for Substrate Temperature Uniformity
Solution Overview
Problem
Semiconductor processing chambers face challenges in achieving uniform temperature distribution during thermal processes, as portions of the chamber act as heat sinks, leading to temperature non-uniformity on the substrate.
Innovation Solution
The implementation of absorber bodies made of dark materials, such as anodized aluminum, positioned within the chamber to absorb infrared radiation and counterbalance temperature gradients, combined with a substrate support system that includes heating elements and a cooling channel to maintain temperature uniformity across the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a substrate is heated in a processing chamber, then the substrate temperature increases, but temperature non-uniformity occurs due to heat sink portions in the chamber
Solution Approach 1:
The chamber is equipped with selectively positioned heating zones and absorber bodies at different locations to create localized thermal characteristics. Heating elements are placed at specific positions to target areas that tend to be cooler, while absorber bodies are positioned to manage heat in specific regions, achieving overall temperature uniformity through non-uniform local treatments.
Solution Approach 2:
Absorber bodies are strategically positioned in the chamber to preemptively counteract the heat sink effect of chamber portions before they can cause significant temperature non-uniformity. These absorber bodies absorb excess heat in regions that would otherwise act as heat sinks, preventing temperature gradients from developing.
2Manufacturing precision
If absorber bodies are added to improve thermal uniformity, then temperature gradients are reduced, but chamber complexity increases
Solution Approach 1:
The thermal management function is extracted from the chamber walls and implemented as separate, movable absorber bodies. This allows the absorber elements to be independently positioned and adjusted without modifying the chamber structure, simplifying the overall system while achieving the desired thermal uniformity.
Solution Approach 2:
The absorber bodies are designed to be movable and repositionable within the chamber, allowing dynamic adjustment of their positions to optimize thermal uniformity for different substrate sizes and processing conditions. This dynamic capability provides flexibility without requiring a complex fixed structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution achieves a minimal within-substrate temperature gradient of about 10°C or less, allowing for precise temperature control from room temperature to 500°C, thereby enhancing thermal uniformity and preventing substrate distortion during heating processes.
Implementation Method 1
one or more absorber bodies positioned in the interior volume in a position opposite of the substrate transfer port
Implementation Method 2
a substrate support disposed in the interior volume, and one or more absorber bodies positioned in the interior volume about the substrate support
Implementation Method 3
a substrate support system that includes heating elements and a cooling channel to maintain temperature uniformity across the substrate
Data Source
AI summary
Embodiments of the disclosure generally relate to a semiconductor processing chamber. In one embodiment, semiconductor processing chamber is disclosed and includes a chamber body having a bottom and a sidewall defining an interior volume, the sidewall having a substrate transfer port formed therein, and one or more absorber bodies positioned in the interior volume in a position opposite of the substrate transfer port.