Standalone Thermal Chamber for Concurrent Electronic Device Testing
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Solution Overview
Problem
Conventional thermal testing chambers are limited in their ability to simultaneously test multiple electronic devices at different temperatures, requiring extensive time and resources, as they can only apply a single temperature condition to all devices at once and perform a single test process at a time.
Innovation Solution
A thermal chamber with multiple sides that can transition between closed and open positions, equipped with adjustable standoffs and temperature control components, allowing for concurrent testing of multiple electronic devices under various temperature conditions, enabling different electronic systems to be tested simultaneously with adjustable thermal coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single thermal chamber applies a single temperature to all electronic devices at once, then the chamber structure remains simple and easy to operate, but the testing efficiency is low and extensive time is required to test devices at multiple temperatures
Solution Approach 1:
The thermal chamber is divided into multiple independent thermal zones, each capable of maintaining different temperature conditions simultaneously. This segmentation allows multiple electronic devices to be tested at different temperatures at the same time, significantly improving testing efficiency without requiring a single complex chamber to handle all temperature variations.
Solution Approach 2:
The patent introduces a vertical dimension to the thermal chamber design by incorporating adjustable standoffs that allow electronic devices to be positioned at different heights. This vertical positioning enables different thermal coupling configurations, where devices at different vertical positions can experience different thermal conditions, adding another dimension to the testing capability.
2Loss of time
If a thermal chamber tests multiple electronic devices at different temperatures simultaneously, then testing efficiency improves, but the chamber structure becomes more complex with multiple temperature control systems
Solution Approach 1:
The thermal chamber is divided into multiple independent thermal zones, each capable of maintaining different temperature conditions simultaneously. This segmentation allows multiple electronic devices to be tested at different temperatures at the same time, significantly improving testing efficiency without requiring a single complex chamber to handle all temperature variations.
Solution Approach 2:
The patent employs adjustable thermal coupling mechanisms that allow the thermal coupling parameter between the heat spreader and electronic devices to be varied. By changing the thermal coupling parameter through adjustable standoffs and different positioning configurations, the system can optimize heat transfer conditions for each device without requiring completely separate temperature control systems for each zone.
3Adaptability or versatility
If adjustable standoffs are used to position electronic devices at different heights, then thermal coupling flexibility improves, but the device assembly complexity increases
Solution Approach 1:
The patent incorporates adjustable and reconfigurable standoff mechanisms that allow the positioning of electronic devices to be dynamically changed. These adjustable standoffs can be easily repositioned to different heights and configurations, enabling flexible thermal coupling arrangements without requiring permanent or complex fixed assemblies. The dynamic adjustability simplifies the assembly process compared to fixed complex structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables rapid and efficient thermal testing of multiple electronic devices under diverse conditions, enhancing reliability by allowing for the identification of defects or flaws in design or manufacturing, and optimizing the use of resources by performing multiple tests quickly.
Implementation Method 1
A thermal chamber with multiple sides that can transition between closed and open positions, equipped with adjustable standoffs and temperature control components, allowing for concurrent testing of multiple electronic devices under various temperature conditions
Data Source
AI summary
A thermal chamber multiple sides that form an enclosed chamber. The thermal chamber includes a first side of the multiple sides, the first side configured to adjustably mount an electronic circuit board within the enclosed chamber. The thermal chamber includes a second side of the multiple sides, the second side located opposite the first side and including one or more ports that expose the enclosed chamber. Each of the one or more ports is configured to receive a temperature control component that transfers thermal energy locally to and from a plurality of electronic devices of an electronic system that is coupled to and positioned above the electronic circuit board.