Thermal Clutch for Simultaneous Heating and Cooling in Device Testing
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Solution Overview
Problem
Existing temperature control methods for electronic devices, such as integrated chips, are limited by the use of thermoelectric controllers, which restrict maximum thermal transfer capability and are prone to failure, with a time delay between heating and cooling phases, lengthening testing times.
Innovation Solution
A thermal clutch mechanism is introduced to selectively couple and decouple a cooling device from the device under test, allowing for a wide temperature range without using TEC modules, enabling simultaneous cooling and heating without stopping the cooling source, thus reducing testing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a thermoelectric controller (TEC) is used to control temperature over a wide range, then temperature control capability is improved, but maximum thermal transfer capability is limited and the system is prone to failure
Solution Approach 1:
The thermal control system is segmented into separate heating and cooling subsystems. The cooling subsystem uses a cooling device (such as a heat sink or coolant system) while the heating subsystem uses a heating device (such as a heating element). This segmentation allows each subsystem to operate independently at its optimal capability without the limitations of a single TEC module, thereby improving both temperature control capability and system reliability.
Solution Approach 2:
The thermal control unit is designed with multi-functionality by incorporating both cooling and heating capabilities through separate devices. This universal design allows the system to handle a wider temperature range more effectively and provides redundancy, improving reliability while maintaining adaptability across different temperature conditions.
2Ease of operation
If a TEC module is used for temperature control, then temperature regulation is achieved, but time delay occurs between heating and cooling phases which lengthens testing times
Solution Approach 1:
The cooling device is designed to remain in a standby state during heating phases rather than being completely shut down. This preliminary positioning allows the cooling device to quickly resume operation when cooling is needed, eliminating the time delay that would otherwise occur while the TEC module switches between heating and cooling modes.
Solution Approach 2:
The cooling device maintains continuous readiness to provide cooling functionality, rather than being completely deactivated during heating phases. This continuity ensures that when temperature control is needed, the cooling capability is immediately available, significantly reducing the time required for temperature transitions during testing.
3Ease of operation
If DC flow in TEC is switched to switch between cooling and heating, then temperature control is achieved, but time delay results between phases
Solution Approach 1:
The system employs dynamic control where the cooling device operates in different states (active cooling, standby, or off) based on real-time temperature requirements. During heating phases, the cooling device transitions to a standby state rather than complete shutdown, allowing for rapid response when cooling is needed. This dynamic operation eliminates the response delay inherent in switching TEC modules while maintaining effective temperature control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for efficient temperature control over a wider range, reducing testing time and avoiding the limitations of conventional methods by maintaining cooling while heating, thereby improving the reliability and efficiency of electronic device testing.
Implementation Method 1
a cooling device (300) or variable heat sink... which absorbs heat energy
Implementation Method 2
a heating device (400) or heat source... which delivers heat energy
Data Source
Figure 1
Figure 2A~2B
Figure 3
AI summary
Featured are devices, systems and methods for testing an electronic device, such as an integrated chip. Such a testing method includes disposing a thermal clutch between a variable heat sink that absorbs heat energy and a heat source member that selectively delivers heat energy. When the thermal clutch is operated in a first manner the thermal clutch thermally couples the variable heat sink to the electronic device under test (DUT) and when operated in the second manner, the thermal clutch thermally de-couples the variable heat sink from the DUT. Also, when the thermal clutch is operated in the second manner, the heat source member is thermally coupled to the DUT and is operated so as to produce heat energy which is thus provided to the thermally coupled DUT.