Thermal Code Transmission Circuit Without Global Metal Lines
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Solution Overview
Problem
The existing semiconductor memory devices, such as mobile DRAM, require a large global metal line to transmit thermal codes from a thermal sensor to a DQ pad, which increases the chip size and necessitates a larger output driver, due to the spatial constraints of the input pad unit.
Innovation Solution
A thermal code transmission circuit that generates select signals to output thermal codes directly through a TQ pad in the input pad unit, eliminating the need for a global metal line by using a select signal generator, level signal generator, update signal generator, latch unit, and thermal code output unit to selectively output thermal codes and high-temperature determination signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal codes are transmitted through a global metal line from the thermal sensor to a DQ pad, then the thermal information can be delivered to the data pad unit, but the chip size and output driver size increase significantly
Solution Approach 1:
The patent changes the transmission path dimension by routing thermal codes through the input pad unit's TQ pad instead of using the global metal line that spans across the peri-area. This dimensional change in signal routing eliminates the need for long-distance horizontal transmission, thereby reducing the required metal line area and chip size.
Solution Approach 2:
The patent extracts the thermal code transmission function from the global metal line system and relocates it to the input pad unit. By separating the thermal code transmission path from the data transmission path, the global metal line area is reduced while thermal information is efficiently transmitted through the locally available TQ pad.
2Reliability
If thermal codes are transmitted through a global metal line, then thermal information reaches the DQ pad, but the output driver must be enlarged to handle the transmission
Solution Approach 1:
The patent extracts the thermal code transmission function from the output driver's responsibility and relocates it to the input pad unit. The TQ pad in the input pad unit directly transmits thermal codes without requiring the output driver to handle this additional signal, thereby reducing the output driver size and complexity.
Solution Approach 2:
The patent introduces the TQ pad in the input pad unit as an intermediary for thermal code transmission. This intermediary handles the thermal code delivery locally, preventing the need for the output driver to be enlarged for long-distance thermal signal transmission through the global metal line.
3Reliability
If a large global metal line is used to transmit thermal codes, then thermal information can be transmitted across the chip, but power consumption increases
Solution Approach 1:
The patent changes the transmission path from a long-distance global metal line route to a local input pad unit route through the TQ pad. This dimensional change in signal routing dramatically reduces the transmission distance, thereby reducing the power consumption associated with driving long metal lines across the chip.
Data Source
AI summary
Disclosed are a thermal code transmission circuit and a semiconductor memory device using the same. The thermal code transmission circuit includes a select signal generator which generates a select signal in response to a first enable signal, a level signal generator which receives the first enable signal to generate a level signal, an update signal generator which receives the level signal and a first update signal to generate a second update signal, a latch unit which receives a thermal code in response to the second update signal and outputs the thermal code as an output thermal code, and a thermal code output unit which selectively outputs the output thermal code in response to the select signal.