Thermally Conductive Composition With Surface-Modified Fillers for Adhesion
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Solution Overview
Problem
Existing thermally conductive materials face challenges in achieving adequate adhesiveness to promote effective heat dissipation from power semiconductor devices, particularly in miniaturized electrical components.
Innovation Solution
A composition comprising surface-modified inorganic substances and a thermosetting compound, where the inorganic substances are modified with specific surface modifiers to enhance adhesiveness, forming a thermally conductive material with improved bonding strength through chemical interactions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional surface modifiers (organosilicon-based or organophosphorus-based coupling agents) are used on inorganic fillers, then the thermally conductive material can be formed, but the adhesiveness with the adhesive body is insufficient
Solution Approach 1:
The patent uses a composite surface modifier containing both silane-based coupling agent and phenolic resin on the inorganic filler surface. This composite modification approach combines the adhesion benefits of silane groups with the bonding capabilities of phenolic resin, achieving superior adhesiveness to adhesive bodies while maintaining thermal conductivity.
Solution Approach 2:
The patent changes the chemical composition parameters of the surface modifier by introducing specific functional groups (silane groups, phenolic hydroxyl groups) and controlling their ratios. This parameter optimization enables the surface-modified filler to form strong chemical bonds with both the resin matrix and the adhesive body, resolving the adhesion problem.
2Temperature
If inorganic filler is used for thermal conduction, then heat dissipation is promoted, but aggregation of filler particles occurs reducing effectiveness
Solution Approach 1:
The patent optimizes the surface modifier composition parameters, specifically the ratio of silane-based coupling agent to phenolic resin, and controls the content of hydroxyl groups. These parameter adjustments improve filler dispersion stability by preventing aggregation while maintaining thermal conduction pathways.
Solution Approach 2:
The composite surface modification approach creates a stable interface between filler particles and the resin matrix, preventing filler aggregation. The dual-function surface modifier ensures both good dispersion and effective thermal conduction, resolving the contradiction between heat dissipation and dispersion stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition results in a thermally conductive material with enhanced adhesiveness, reducing aggregation and improving the overall heat dissipation performance of power semiconductor devices.
Implementation Method 1
a surface modifier A and a surface modifier B which are adsorbed on a surface of the inorganic substance
Implementation Method 2
a thermosetting compound... forming a thermally conductive material with improved bonding strength through chemical interactions
Data Source
AI summary
The present invention provides a composition for forming a thermally conductive material, from which a thermally conductive material having excellent adhesiveness can be obtained. In addition, the present invention provides a thermally conductive material and a surface-modified inorganic substance. The composition for forming a thermally conductive material of the present invention is a composition for forming a thermally conductive material containing a surface-modified inorganic substance and a thermosetting compound, the surface-modified inorganic substance satisfying at least one of Requirement 1 or Requirement 2. Requirement 1: The surface-modified inorganic substance includes a surface-modified inorganic substance X containing the inorganic substance, and a surface modifier A and a surface modifier B adsorbed on a surface of the inorganic substance. Requirement 2: The surface-modified inorganic substance includes a surface-modified inorganic substance A containing the inorganic substance and the surface modifier A adsorbed on the surface of the inorganic substance, and a surface-modified inorganic substance B containing the inorganic substance and the surface modifier B adsorbed on the surface of the inorganic substance.