Thermal Compound Nanofiller Packing for Semiconductor Heat Dissipation
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Solution Overview
Problem
Conventional thermal compounds used in power semiconductor modules have low thermal conductivity, and increasing the filler content to improve this leads to reduced workability and increased void ratios, posing challenges in effectively managing thermal resistance.
Innovation Solution
Incorporating nano-sized fillers into a thermal compound composed of a base oil and ceramic microfillers, with specific particle size and volume ratios, to enhance thermal conductivity while maintaining workability and reducing void ratios.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the amount of ceramic filler in the thermal compound is increased to improve thermal conductivity, then thermal conductivity increases, but viscosity increases and workability during coating deteriorates
Solution Approach 1:
The patent changes the particle size parameter of the ceramic filler by introducing nanosized particles (1-100 nm) in addition to microsized particles. This parameter change allows achieving high thermal conductivity with lower overall filler content, thereby maintaining lower viscosity and better workability during coating operations.
Solution Approach 2:
The patent creates a composite filler system combining nanosized ceramic particles (1-100 nm) with microsized ceramic particles (1-500 μm). This composite structure synergistically improves thermal conductivity while the nanosized particles fill interstices between micro particles, enabling high filler loading without excessive viscosity increase, thus maintaining workability.
2Reliability
If the amount of ceramic filler in the thermal compound is increased to improve thermal conductivity, then thermal conductivity increases, but the void ratio in the product after coating increases
Solution Approach 1:
The patent changes the particle size distribution parameter by incorporating nanosized ceramic particles (1-100 nm) that can fill voids and interstices between microsized particles. This parameter optimization reduces the void ratio in the final coated product while achieving high thermal conductivity through efficient particle packing.
Solution Approach 2:
The composite filler system of nanosized (1-100 nm) and microsized (1-500 μm) ceramic particles creates a hierarchical structure where nan particles fill the gaps between micro particles. This reduces void spaces and improves packing density, thereby reducing void ratio while enhancing thermal conductivity pathways.
3Reliability
If the relative proportion of base oil in the thermal compound is decreased to increase filler content, then filler content increases, but viscosity increases and workability deteriorates
Solution Approach 1:
The patent changes the particle size parameter of the filler to include nanosized particles (1-100 nm) that have high surface area to volume ratio and can pack efficiently. This allows achieving high filler content with better flow characteristics, reducing the need to decrease base oil proportion excessively, thereby maintaining workability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively improves thermal conductivity and suppresses thermal resistance, ensuring high reliability and workability of semiconductor devices by optimizing the filler composition and particle sizes within the thermal compound.
Implementation Method 1
the thermal conductivity of the thermal compound be increased... found that further adding a nano-sized filler to a thermal compound formed mainly of a base oil and a ceramic filler can smooth the connection of the ceramic, increase the filling rate of a ceramic with high thermal conductance, and improve thermal conductivity
Data Source
AI summary
A semiconductor device, including: a semiconductor module including a layered substrate on which a semiconductor element is mounted, and a sealing material; and a cooler provided on the semiconductor module via a thermal compound. The thermal compound includes a base oil, microfillers having a ceramic as a main component, and nanofillers having a resin as a main component.