Thermal Conduction System for Portable Information Handling

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Solution Overview

Problem

Portable information handling systems face thermal challenges due to their compact size and mobility requirements, which limit the effectiveness of conventional cooling solutions, often necessitating performance compromises to maintain weight and size constraints.

Innovation Solution

A thermal conduction cooling system utilizing thermally conductive pins and apertures in the portable information handling system's bottom cover, which contacts a docking station's thermal interface material to provide efficient heat dissipation without increasing the device's size or exposing users to hot components, while maintaining mobility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional cooling solutions are used in portable information handling systems, then the system can maintain its compact size and mobility, but the thermal dissipation effectiveness is limited and performance compromises are necessary

Engineering Contradiction:

Improvethermal dissipation effectivenessVSAvoiddevice size

Core Design Contradiction:

TemperatureVSVolume of moving object

Solution Approach 1:

The patent extends the thermal management solution from the internal 3D space to an external dimension by implementing thermal conduction through the bottom cover to an external docking station. The thermal conduction path exits the portable device through bottom cover apertures and continues through thermally conductive pins in the docking station, effectively adding a fourth dimension (external space) to the thermal dissipation pathway. This resolves the contradiction by enabling enhanced cooling without increasing the device's internal volume.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Temperature

If additional cooling components are added to improve thermal dissipation, then the cooling capacity increases, but the device weight and size increase

Engineering Contradiction:

Improvecooling capacityVSAvoiddevice weight

Core Design Contradiction:

TemperatureVSWeight of moving object

Solution Approach 1:

The portable information handling system utilizes the docking station's thermal interface and structure to provide cooling assistance. Instead of adding heavy active cooling components (fans, heat sinks) to the portable device, the system leverages the external docking station's thermal mass and conduction path to dissipate heat. The bottom cover and thermally conductive pins act as passive thermal conduits, allowing the external environment to serve the cooling function.

Inventive Principle:

Principle #25Self-service

3Strength

If the bottom cover is made solid to protect internal components, then structural protection is improved, but thermal dissipation is reduced

Engineering Contradiction:

Improvestructural protectionVSAvoidthermal dissipation

Core Design Contradiction:

StrengthVSTemperature

Solution Approach 1:

The bottom cover is designed with non-uniform properties: most of the cover maintains solid structure for protection, while specific localized regions contain apertures for thermal conduction. The apertures are strategically positioned to allow thermal contact with docking station pins while the surrounding solid material provides structural integrity. This local differentiation resolves the contradiction between overall structural strength and localized thermal dissipation needs.

Inventive Principle:

Principle #3Local quality

4Ease of operation

If conventional thermal interfaces are used, then the device maintains portability, but touch temperature issues occur and user safety is compromised

Engineering Contradiction:

ImproveportabilityVSAvoidtouch temperature

Core Design Contradiction:

Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The docking station's thermal interface acts as an intermediary between the internal hot components and the user's hands. The thermally conductive pins in the docking station provide a dedicated thermal pathway that draws heat away from components before it can conduct to the external housing surfaces that users touch. This intermediary thermal path resolves the contradiction by maintaining portability while eliminating the harmful thermal conduction to user-contact surfaces.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution provides additional cooling capacity of over 100 W, reduces airflow impedance, and eliminates touch temperature issues, allowing for improved performance when docked without compromising portability.

Implementation Method 1

a thermal cooling device, the thermal cooling device comprising a thermal interface material component, the thermal interface material component being configured to contact a docking station thermal component of a docking station

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20240361815A1Thermal Conduction System for use with a Portable Information Handling System

Publication Date: 2024.10.31 DELL PROD LP

AI summary

A main housing portion of a portable information handing system. The main housing portion includes: a top cover portion; a bottom cover portion defining a plurality of bottom cover portion apertures and, a thermal cooling device, the thermal cooling device comprising a thermal interface material component, the thermal cooling device comprising a thermal interface material component, the thermal interface material component being configured to contact a docking station thermal component of a docking station.