Thermal conduction principle and device for intercrossed structure having different thermal characteristics
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Solution Overview
Problem
Conventional thermal conducting structures made of single materials face limitations in thermal conductivity and specific heat capacity, leading to inefficient heat dissipation in devices like CPUs, power semiconductors, and LEDs, as they either prioritize thermal conductivity over specific heat capacity or vice versa, resulting in suboptimal thermal conducting effects.
Innovation Solution
A multi-layered thermal conduction device with a cross-layered overlapping structure, where a relay thermal conductor with high thermal conductivity is coupled with an interface thermal conductor having higher specific heat capacity, better thermal conductivity, or improved thermal emissivity, facilitating thermal energy conduction between thermal bodies with a temperature difference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Difficulty of detecting and measuring
If copper material is used for heat dissipator, then thermal conductivity coefficient is improved, but specific heat capacity deteriorates (lower than aluminum)
Solution Approach 1:
The patent applies composite materials by combining copper and aluminum in a multi-layered thermal conduction device. The copper layer provides high thermal conductivity for efficient heat transfer from the heat source, while the aluminum layer contributes high specific heat capacity for effective heat storage and dissipation. This composite structure resolves the contradiction by integrating the complementary advantages of both materials.
Solution Approach 2:
The thermal conduction device is segmented into multiple layers with different materials (copper and aluminum) positioned at different locations. The copper layer is typically positioned closer to the heat source to maximize thermal conductivity, while the aluminum layer is positioned to maximize heat dissipation. This segmentation allows each material to perform its optimal function without compromising the other.
2Quantity of substance
If aluminum material is used for heat dissipator, then specific heat capacity is improved, but thermal conductivity coefficient deteriorates (lower than copper)
Solution Approach 1:
The patent uses composite materials where aluminum and copper are combined in a multi-layered structure. The aluminum layer leverages its high specific heat capacity for heat storage and dissipation, while the copper layer compensates for the lower thermal conductivity with its superior heat transfer properties. This composite approach allows the system to benefit from both material characteristics simultaneously.
Solution Approach 2:
The device is segmented into functional layers where aluminum and copper are positioned strategically. The aluminum layer is positioned to maximize its heat storage capability, while the copper layer is positioned to maximize heat transfer from the source. This segmentation enables each material to optimize its contribution to the overall thermal management.
3Device complexity
If single material structure is used, then device complexity is reduced, but thermal conducting effect deteriorates due to limited thermally conducting area
Solution Approach 1:
The patent employs composite materials in a multi-layered configuration to enhance the thermal conducting effect. By combining materials with different thermal properties, the device achieves superior overall thermal performance compared to single-material structures, while the layered design maintains reasonable manufacturing complexity.
Solution Approach 2:
The patent transitions from a single-material approach to a multi-layered structure, adding the dimension of material diversity. This dimensional change allows the device to optimize thermal conduction by positioning different materials in different spatial layers, thereby enhancing the thermally conducting area and overall thermal efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal energy conduction by optimizing thermal characteristics across layers, allowing for more effective heat dissipation or absorption in various applications, including electronics, cookware, and industrial devices, by leveraging the unique properties of different materials to manage thermal flow and temperature differences.
Implementation Method 1
relay thermal conductor of the thermal conduction device being made of material with high thermal conductivity coefficient is thermal conductively coupled with a heating or cooling first thermal body
Implementation Method 2
interface thermal conductor having the thermal conducting characteristics with all or at least one of the 1) higher specific heat capacity relative to relay thermal conductor, or 2) a better thermal conductivity coefficient to second thermal body relative to relay thermal conductor, or 3) a better thermal emissivity to second thermal body relative to relay thermal conductor
Data Source
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AI summary
The present invention relates to relay thermal conductor made of material having better thermal conductivity coefficient, wherein which is thermal conductively coupled with heating or cooling first thermal body at one end or face thereof, and is coupled with interface thermal conductor having higher specific heat capacity at the other end or face thereof; the relay thermal conductor directly performs thermal conduction with second thermal body at another part thereof; and the interface thermal conductor having higher specific heat capacity is the thermal conducting carrier between the relay thermal conductor and the second thermal body.