Thermal Conduction Device Radial Force Locking
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Solution Overview
Problem
Existing thermal conduction devices between heat source and dissipation parts suffer from suboptimal thermal transfer quality and rapid wear, especially when subjected to vibrations or movement, making them cumbersome and difficult to implement in electrical or electronic systems.
Innovation Solution
A thermal conduction device utilizing male and female elements with different thermal expansion coefficients, where the male element exerts a radial force against the female element, enhancing thermal contact and providing axial locking, thus improving thermal conduction and reducing wear through the use of a spring-based pressing mechanism and maintaining member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional heat sinks are mounted on printed circuit boards, then heat dissipation is achieved, but the system becomes bulky and difficult to implement
Solution Approach 1:
The thermal conduction device is divided into separate male and female elements that can be independently positioned and assembled, allowing for more flexible system integration and reduced overall volume compared to traditional monolithic heat sinks
Solution Approach 2:
The male element is inserted into the female element, creating a nested structure that minimizes space requirements while maintaining effective thermal conduction between the heat source and dissipation components
2Temperature
If thermal conduction devices are used between heat source and dissipation parts, then heat transfer is improved, but the devices wear out quickly under vibrations and movement
Solution Approach 1:
The device incorporates a spring element that provides dynamic adaptability, allowing the thermal conduction interface to self-adjust and maintain optimal contact pressure under varying conditions including vibrations and thermal expansion, thereby improving reliability
Solution Approach 2:
The spring mechanism changes the contact pressure parameter dynamically in response to thermal expansion and mechanical stresses, maintaining consistent thermal conduction quality while accommodating movements and vibrations that would otherwise cause wear
3Temperature
If male and female elements exert radial force on each other, then thermal contact is improved, but device complexity increases
Solution Approach 1:
The device utilizes differential thermal expansion between the male and female elements to generate the radial forcing action, converting a thermal phenomenon into a mechanical benefit that improves thermal contact without requiring complex external actuation mechanisms
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves optimal thermal transfer and reduces wear, allowing for easier installation and improved heat dissipation in electrical or electronic systems, even in environments with vibrations.
Implementation Method 1
the male element and the female element have different respective overall thermal expansion coefficients, such that when the temperature of the conduction device is above a predetermined threshold, the protruding part exerts the radial force against the inner wall
Implementation Method 2
the pressing member is a spring extending between the base and the base plate along the central axis
Implementation Method 3
a thermal conduction device intended to be installed between a first heat source part and a second heat dissipation part
Data Source
AI summary
This thermal conduction device intended to be installed between a first heat source part and a second heat dissipation part, comprises a male element comprising a protruding part relative to a base and a female element comprising an inner wall defining a housing for receiving the protruding part. The male element is configured to exert a radial force against the inner wall when the thermal conduction device is installed between the first heat source part and the second heat dissipation part so as to improve the thermal conduction between the male element and the female element.