Thermal Conductive Composition with Optimized Filler Shape Factors
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Solution Overview
Problem
Existing compositions for molded articles, such as fixing members, face challenges in achieving high thermal conductivity while maintaining strength and cost-effectiveness, particularly due to the difficulty in controlling filler alignment and the increased costs associated with high filler content.
Innovation Solution
A composition comprising thermal conductive fillers with specific shape factors (SF1 of 120-400 and SF2 of 140-325) and a resin or rubber, which enhances thermal conductivity and bending resistance without the need for precise filler alignment, thereby reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If high filler content is used to improve thermal conductivity, then thermal conductivity increases, but manufacturing cost increases and structural integrity deteriorates
Solution Approach 1:
The invention changes the shape parameters of the filler particles (aspect ratio and circularity) to optimize thermal conductivity. By controlling the aspect ratio within 1.1-3.0 and circularity within 0.75-0.95, the patent achieves effective thermal conduction pathways without requiring excessive filler content, thus avoiding increased manufacturing costs and maintaining structural integrity.
Solution Approach 2:
The invention uses composite materials by combining specifically shaped filler particles with a polymer matrix. The composite structure leverages the thermal conductivity of the fillers while the polymer matrix provides structural support, achieving a balance between thermal performance and mechanical properties without requiring high filler content that would increase cost and reduce strength.
2Temperature
If high filler content is used to improve thermal conductivity, then thermal conductivity increases, but bending resistance deteriorates
Solution Approach 1:
The invention changes the shape parameters of filler particles (aspect ratio and circularity) to create optimal thermal conduction pathways at lower filler contents. This prevents the degradation of bending resistance that occurs with high filler content, while still achieving the desired thermal conductivity through efficient particle geometry that promotes heat transfer.
Solution Approach 2:
The invention applies local quality by optimizing filler particle shape characteristics (specific aspect ratio and circularity ranges) to create regions of efficient thermal conduction without uniformly distributing excessive filler throughout the material. This localized optimization of thermal pathways maintains overall structural integrity and bending resistance.
3Temperature
If filler alignment is controlled precisely to improve thermal conductivity, then thermal conductivity increases, but device complexity increases
Solution Approach 1:
The invention changes the shape parameters of filler particles (aspect ratio and circularity) to inherently promote alignment during standard processing operations. The specific geometric characteristics cause particles to self-align in the extrusion direction without requiring complex alignment control systems or additional processing steps, thus achieving high thermal conductivity with simple manufacturing processes.
Solution Approach 2:
The invention enables self-alignment of filler particles through their specific shape characteristics. The aspect ratio and circularity parameters cause particles to automatically orient themselves in the direction of heat transfer during normal extrusion processing, eliminating the need for external alignment control mechanisms or complex processing procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves thermal conductivity of 1.2 W/mK or more, improving heat dissipation properties and bending resistance while maintaining a filler content of 20% by volume or less, thus balancing thermal performance and structural integrity.
Implementation Method 1
a composition containing at least one or more thermal conductive fillers and a resin or rubber, in which the fillers have a shape factor SF1 of 120 or more and 400 or less and a shape factor SF2 of 140 or more and 325 or less
Data Source
AI summary
A composition contains at least one or more thermal conductive fillers and a resin or rubber, in which the fillers have a shape factor SF1 of 120 or more and 400 or less and a shape factor SF2 of 140 or more and 325 or less.