Thermal Conductive Layer for Circuit Board Heat Dissipation
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Solution Overview
Problem
As electronic devices become more multifunctional, circuit substrates face deformation and potential damage from excessive heat generated by electronic components, necessitating effective heat dissipation methods.
Innovation Solution
A method involving fluffy carbon nanotubes is used to create a thermal conductive layer by compacting carbon nanotube bundles between insulating layers, which are then integrated into a circuit board structure to facilitate heat dissipation, allowing for efficient heat conduction and distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic components are increased to make devices more multifunctional, then device functionality is improved, but heat generation increases causing substrate deformation and component damage
Solution Approach 1:
The patent introduces a thermal conductive layer as an intermediary substance between the circuit substrate and heat-generating components. This layer contains carbon nanotubes that act as heat transfer mediators, conducting heat away from electronic components to prevent temperature buildup while allowing the components to remain in place and continue generating necessary heat for operation
2Temperature
If traditional heat dissipation methods are used, then some heat can be removed, but the manufacturing process becomes complex and costly
Solution Approach 1:
The patent changes the physical state and arrangement parameters of carbon nanotubes by applying pressure to transform fluffy carbon nanotubes into a compact thermal conductive layer. This parameter change (from loose to compressed state) enhances thermal conductivity while maintaining manufacturing simplicity, avoiding complex multi-step processes
3Temperature
If conventional thermal conductive materials are used, then heat conduction is achieved, but manufacturing cost and energy consumption increase
Solution Approach 1:
The patent employs carbon nanotubes as a cost-effective thermal conduction material that can be processed through simple pressing operations. The use of carbon nanotubes in compressed form provides effective heat conduction at lower material and processing costs compared to conventional thermal interface materials, reducing overall manufacturing energy consumption
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively dissipates heat generated by electronic components, preventing substrate deformation and component damage, while also reducing manufacturing costs and energy consumption through a simple pressing process.
Implementation Method 1
fluffy carbon nanotubes, which can be used to prepare a thermal conductive layer... efficiently dissipate heat
Data Source
AI summary
A method for manufacturing a circuit board, includes: stacking a first peelable film on a second peelable film, and disposing fluffy carbon nanotubes between the first peelable film and the second peelable film, thereby obtaining a carbon nanotube layer; pressing the first peelable film, the carbon nanotube layer, and the second peelable film to compact the fluffy carbon nanotubes, thereby obtaining a thermal conductive layer; removing the first peelable film, and disposing a first adhesive layer, a first dielectric layer, and a first circuit layer on a side of the thermal conductive layer away from the second peelable film; removing the second peelable film, and disposing a second adhesive layer, a second dielectric layer, and a second circuit layer on a side of the thermal conductive layer away from the first adhesive layer; mounting an electronic component on the first circuit layer.