Electromagnetic Wave Absorbing Thermal Conductive Sheet for Semiconductor Cooling
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Solution Overview
Problem
Conventional semiconductor devices face challenges in achieving both excellent heat transferring performance and electromagnetic wave suppression due to the inherent properties of metallic heat transferring components, which act as antennas for harmonic noise components.
Innovation Solution
A semiconductor device design featuring a conductive shield can connected to ground, with an opening for an electromagnetic wave absorbing thermal conductive sheet that connects the semiconductor element to a cooling member, enhancing heat transferring performance without compromising electromagnetic wave absorption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metallic heat transferring component is used, then heat transferring performance is improved, but electromagnetic wave suppression deteriorates
Solution Approach 1:
The heat transferring component is divided into multiple layers: a non-metallic base layer (heat dissipation plate or heat pipe) and a metallic electromagnetic wave shielding layer. This segmentation allows each layer to perform its specialized function - the non-metallic layer handles heat transfer while the metallic layer suppresses electromagnetic waves, resolving the contradiction between heat transferring performance and electromagnetic wave suppression.
Solution Approach 2:
The invention uses a composite structure combining non-metallic thermal conduction materials (such as aluminum nitride, silicon carbide, or copper-wire embedded resin) with metallic shielding materials. This composite approach enables simultaneous achievement of excellent thermal conductivity and electromagnetic wave absorption, as the non-metallic layer provides thermal pathways while the metallic layer absorbs electromagnetic energy without acting as an antenna.
2Object-generated harmful factors
If a conductive shield can is used, then electromagnetic wave suppression is improved, but heat transferring performance deteriorates
Solution Approach 1:
The non-metallic heat transferring component acts as an intermediary between the semiconductor element and the conductive shield can. It provides an efficient thermal conduction path from the heat source to the shield can, while the shield can maintains electromagnetic wave suppression. The intermediary enables thermal energy transfer without requiring the shield can itself to be thermally conductive, thus preserving both electromagnetic wave suppression and heat transferring performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively achieves both superior heat transferring performance and electromagnetic wave suppression by utilizing a conductive shield with an electromagnetic wave absorbing thermal conductive sheet, improving thermal conduction while maintaining electromagnetic wave shielding.
Implementation Method 1
an electromagnetic wave absorbing thermal conductive sheet formed between the semiconductor element and the cooling member at least through the opening of the conductive shield can
Implementation Method 2
excellent electromagnetic wave absorption performance can be achieved by covering a semiconductor element with a conductive shield can connected to a ground
Data Source
AI summary
Provided is a semiconductor device having excellent heat transferring performance and electromagnetic wave suppression effect. A semiconductor device 1 comprises: a semiconductor element 30 formed on a substrate 50; a conductive shield can 20 having an opening 21, covering at least a part of the semiconductor element 30, and connected to a ground 60; a cooling member 40 located above the conductive shield can 20; and an electromagnetic wave absorbing thermal conductive sheet 10 formed between the semiconductor element 30 and the cooling member 40 at least through the opening 21 of the conductive shield can 20.