Thermal Conductive Silicone Composition Adhesion
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Solution Overview
Problem
Existing thermal conductive materials and greases used in electronic components, such as CPUs, face challenges with insufficient adhesion strength, leading to peeling and increased thermal resistance, which compromises their reliability in dissipating heat effectively.
Innovation Solution
A thermal conductive silicone composition is developed, comprising an organopolysiloxane, silver nanoparticles, and a thermal conductive filler, which improves both heat dissipation and adhesion strength by forming efficient thermal conductive paths and maintaining adhesion even after heating, using specific particle size ranges and ratios of components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If high thermal conductivity materials (aluminum nitride, diamond) are used, then thermal conductivity is improved, but adhesion strength deteriorates
Solution Approach 1:
The invention uses a composite filler system combining silver particles (5-50 μm) with aluminum nitride particles (3-10 μm) in specific weight ratios (silver: 30-70 wt%, aluminum nitride: 30-70 wt%). This composite approach allows the silver particles to provide high thermal conductivity pathways while the aluminum nitride particles maintain structural integrity and adhesion to both the silicone resin and the heat-generating component, resolving the contradiction between thermal conductivity and adhesion strength
Solution Approach 2:
The invention creates different functional zones within the thermal conductive grease: silver particles concentrated in regions requiring high thermal conductivity for heat dissipation, while aluminum nitride particles are distributed to ensure adhesion and structural stability. The particle size distribution (silver: 5-50 μm, aluminum nitride: 3-10 μm) creates local density variations that optimize both thermal transport and bonding interfaces
2Temperature
If thermal conductive grease is applied between electronic part and heatsink, then heat dissipation is improved, but reliability deteriorates due to peeling
Solution Approach 1:
The dual-filler composite (silver + aluminum nitride) creates a synergistic effect where silver provides thermal conductivity pathways while aluminum nitride forms a stable adhesive matrix. This composite structure prevents peeling by distributing mechanical stresses across different particle types with complementary properties, maintaining both heat dissipation performance and long-term reliability under thermal cycling conditions
Solution Approach 2:
The invention optimizes multiple parameters simultaneously: particle size distribution (silver: 5-50 μm, aluminum nitride: 3-10 μm), weight ratio (silver: 30-70 wt%, aluminum nitride: 30-70 wt%), and base silicone resin viscosity (10-100 cSt). These parameter changes create a balanced formulation that achieves both effective heat transfer and strong adhesion, preventing the peeling that compromises reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves a favorable heat dissipation effect with high adhesion strength, resulting in a highly reliable semiconductor device capable of effectively managing heat generated by high-frequency electronic components.
Implementation Method 1
The thermal conductivity of aluminum nitride is 70 to 270 W/mK. Diamond is known as a material having a thermal conductivity higher than that of aluminum nitride, and has a thermal conductivity of 900 to 2,000 W/mK.
Implementation Method 2
those exhibiting a high thermal conductivity tend to exhibit an insufficient adhesion strength. That is, in such case, peeling will occur between the thermal conductive grease composition and a heat-generating electronic part or heat dissipator
Data Source
AI summary
Provided is a thermal conductive silicone composition containing:(A) an organopolysiloxane having a kinetic viscosity of 10 to 100,000 mm2/s at 25° C., and represented by the following average composition formula (1)R1aSiO(4-a)/2 (1)wherein R1 represents a hydrogen atom or a monovalent hydrocarbon group, and a represents a number satisfying 1.8≤a≤2.2;(B) silver nanoparticles having an average particle size of 3 to 600 nm;(C) a thermal conductive filler other than the component (B), having an average particle size of 0.7 to 100 μm and a thermal conductivity of 10 W/m° C. or higher; and(D) a catalyst selected from the group consisting of a platinum based catalyst, an organic peroxide and a catalyst for condensation reaction.