Thermal Conductive Structure for Semiconductor Package Heat Dissipation
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Solution Overview
Problem
High power density in semiconductor device packages leads to heat dissipation challenges due to inadequate thermal conductivity, particularly in lateral directions, which can result in inefficient heat transfer and potential damage to components.
Innovation Solution
A semiconductor package design incorporating a thermal conductive structure with vertically-aligned fillers and polymeric layers, providing enhanced thermal conductivity in the vertical direction while minimizing lateral conductivity, thus facilitating efficient heat transfer to a heat spreader.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high power density is used in semiconductor device packages, then integration density and processing capability are improved, but heat dissipation becomes insufficient due to inadequate thermal conductivity
Solution Approach 1:
The patent employs a composite thermal conductive structure consisting of vertically-aligned high thermal conductivity fillers (such as aluminum nitride, boron nitride, or silicon carbide particles) embedded in a polymeric matrix. This composite material design enables the substrate to achieve superior thermal conductivity in the vertical direction while maintaining electrical insulation, thereby resolving the heat dissipation issue without compromising integration density
Solution Approach 2:
The patent introduces vertical thermal conduction pathways by aligning filler particles perpendicular to the substrate plane. This dimensional orientation creates dedicated heat transfer channels that conduct heat away from high-power regions in the vertical direction, effectively decoupling thermal management from the lateral electrical signal paths and enabling high power density operation
2Ease of manufacture
If conventional encapsulation methods are used, then manufacturing simplicity is maintained, but filler-induced damage to bonding wires occurs due to inadequate thermal management
Solution Approach 1:
The patent applies thermal conductive fillers selectively in specific regions of the substrate, particularly in high-power density areas, while maintaining a standard polymeric encapsulant in other regions. This localized approach provides enhanced thermal management where needed without compromising bonding wire integrity in low-power regions, and the encapsulation process remains relatively simple
Solution Approach 2:
The patent introduces a thermal conductive underfill material as an intermediary layer between the substrate and the encapsulant. This underfill acts as a thermal bridge that conducts heat away from the substrate before it reaches the encapsulant, preventing filler-induced damage to bonding wires while allowing the use of conventional encapsulation materials and processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables quick and efficient heat dissipation by creating a short thermal path, reducing the risk of delamination and warpage, and maintaining component functionality by avoiding filler-induced damage to bonding wires.
Implementation Method 1
The thermal conductive layer has a first end in contact with the electronic component and a second end in contact with the heat spreader
Implementation Method 2
A semiconductor package design incorporating a thermal conductive structure with vertically-aligned fillers and polymeric layers, providing enhanced thermal conductivity in the vertical direction while minimizing lateral conductivity
Data Source
AI summary
A semiconductor package device includes a substrate, an electronic component, a bonding wire, a heat spreader, a thermal conductive structure and an encapsulant. The electronic component is disposed on the substrate. The bonding wire connects the electronic component to the substrate. The heat spreader is disposed over the electronic component. The thermal conductive structure is disposed between the heat spreader and the electronic component. The thermal conductive structure includes two polymeric layers and a thermal conductive layer. The conductive layer is disposed between the two polymeric layers. The thermal conductive layer has a first end in contact with the electronic component and a second end in contact with the heat spreader. The encapsulant covers the bonding wire.