High Thermal Conductivity Metal Layer for Oxygen Stack Heat Management
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Solution Overview
Problem
The existing electrochemical devices for oxygen recovery face limitations due to significant thermal gradients within the stack, which lead to thermal stresses and potential failure of the dense solid electrolyte membrane and interconnects, restricting oxygen production capacity.
Innovation Solution
Incorporating a high thermal conductivity metal layer, such as silver, between the outer edge of the interconnect and the adjoining electrodes to facilitate heat transfer towards the outer edge, reducing thermal gradients and stresses within the stack.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a dense solid electrolyte membrane is used for oxygen ion transport, then oxygen separation efficiency is improved, but thermal stress and potential membrane failure occur due to significant thermal gradients
Solution Approach 1:
A metal layer with high thermal conductivity is introduced as an intermediary between the dense solid electrolyte membrane and the interconnect. This metal layer acts as a thermal mediator that conducts heat away from the membrane, reducing thermal gradients and preventing membrane failure while maintaining oxygen separation efficiency
Solution Approach 2:
The thermal conductivity parameter of the interconnect structure is changed by adding a metal layer with high thermal conductivity. This parameter change enables more effective heat dissipation, reducing the thermal gradient across the membrane and improving its reliability under operating conditions
2Reliability
If the interconnect is formed from electron-conducting multicomponent metallic oxides, then electrical connection between cells is established, but thermal gradients cause thermal stresses in the interconnect
Solution Approach 1:
The interconnect structure is transformed into a composite material system by combining the electron-conducting multicomponent metallic oxide with a metal layer of high thermal conductivity. This composite structure maintains electrical connection stability while the metal layer component provides enhanced heat dissipation, reducing thermal stresses in the interconnect
3Productivity
If multiple electrochemical cells are stacked in series, then oxygen production efficiency increases, but thermal gradients within the stack intensify
Solution Approach 1:
The thermal management function is segmented and distributed to each interconnect between individual cells in the stack. Each interconnect with its high thermal conductivity metal layer independently manages heat from adjacent cells, enabling the stack to scale to multiple cells without intensifying overall thermal gradients
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The implementation of a high thermal conductivity metal layer effectively decreases thermal stresses and enhances the efficiency and productivity of the oxygen production by improving heat transfer and reducing the likelihood of device failure.
Implementation Method 1
Incorporating a high thermal conductivity metal layer, such as silver, between the outer edge of the interconnect and the adjoining electrodes to facilitate heat transfer towards the outer edge
Data Source
AI summary
The current invention relates to a means for improving heat removal from the inside of an electrochemical device to the outer surface so as to reduce thermal stresses in the device, thereby allowing for increased oxygen production. A means for conducting heat toward the outer edge is provided. The means for conducting heat comprises at least one of silver, gold, platinum, rhodium, and palladium.