Thermal Conductor Opening for Resin Molding in Semiconductor Devices
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Solution Overview
Problem
Conventional semiconductor devices face challenges in manufacturing due to deformation of thin metal wires during resin molding, leading to potential short-circuiting and incomplete resin filling, especially when using the side gate scheme, and the thermal conductor's coverage obstructs resin molding, making it difficult to adopt the top gate scheme.
Innovation Solution
A semiconductor device design featuring a thermal conductor with an opening and a projecting portion around the opening, allowing resin injection through a top gate scheme, which prevents wire deformation and ensures complete resin filling, while the thermal conductor's support portions improve resin flow and adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the side gate scheme is used for resin molding, then the manufacturing process can be simplified, but thin metal wires deform and short-circuit during resin injection
Solution Approach 1:
The patent extracts the thermal conductor from the resin molding process by providing an opening that exposes the thermal conductor surface, allowing the resin to be injected without deforming the thin metal wires while still achieving complete filling
2Temperature
If the thermal conductor covers the entire semiconductor element surface, then heat radiation is improved, but resin injection is obstructed causing incomplete filling
Solution Approach 1:
The patent segments the thermal conductor coverage area by providing an opening that exposes a portion of the thermal conductor surface, dividing it into covered and exposed regions to simultaneously achieve heat radiation and complete resin filling
Solution Approach 2:
The patent applies local quality by having the thermal conductor partially covered by resin and partially exposed, with the exposed portion providing heat radiation while the covered portion allows complete resin filling
3Temperature
If the thermal conductor is exposed from the mold resin member, then heat radiation property is enhanced, but the top gate scheme cannot be adopted due to obstruction
Solution Approach 1:
The patent segments the thermal conductor exposure by providing an opening in the mold resin member that exposes a specific portion of the thermal conductor surface, allowing the top gate scheme to be adopted while maintaining heat radiation capability
Solution Approach 2:
The patent changes the dimensionality of the solution by providing an opening that extends through the mold resin member to expose the thermal conductor, enabling resin injection from the top while maintaining thermal exposure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design stabilizes the quality of semiconductor devices by preventing wire short-circuiting and incomplete filling, enhancing radiation properties and manufacturing yield, and improving high-frequency performance by allowing smooth resin flow and appropriate adhesion.
Implementation Method 1
heat generated by the semiconductor element 1 is dissipated through the via holes 7 and the ball electrodes 8 and also from the major surface (the top surface in FIG. 12) of the semiconductor element 1 via the thermal conductor 9
Implementation Method 2
a mold resin member 6 that molds a part of each of the semiconductor element mounting surface of the substrate 3, the semiconductor element 1, and the thermal conductor 91
Data Source
AI summary
A semiconductor device includes a semiconductor element 1, a thermal conductor 91 located opposite a major surface of the semiconductor element 1, and a mold resin member 6 molding the semiconductor element 1 and at least a part of the thermal conductor 91, wherein at least a part of a top surface of the thermal conductor 91 has an exposed portion exposed from the mold resin member 6, the exposed portion of the thermal conductor 91 has an opening 11, and a periphery of the opening 11 forms a projecting portion 91b projecting toward an opposite side of the semiconductor element 1.