Electronic Thermal Control Using Multi-Point Heat Source Detection

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Solution Overview

Problem

Electronic devices face challenges in accurately controlling heat generation due to variations between internal and surface temperatures, leading to performance deterioration or suboptimal operation.

Innovation Solution

A method is provided to predict current consumption and temperature for each component of an electronic device, allowing for precise control of heat management by comparing power consumption, detecting heat generation locations, and setting target temperatures to reduce power usage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If temperature information from a thermistor is used to control heat, then heat control can be implemented, but the accuracy of heat source identification deteriorates due to the non-constant temperature difference between internal and surface temperatures

Engineering Contradiction:
Improveheat control reliabilityVSAvoidheat source identification precision
Core Design Contradiction:
ReliabilityVSMeasurement precision

Solution Approach 1:

The patent divides the electronic device into multiple temperature zones by placing multiple thermistors at different locations (internal and surface). This segmentation allows independent measurement of temperature at each zone, enabling precise identification of heat sources without relying on a single thermistor reading that suffers from non-constant temperature differences.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from single-point temperature measurement to multi-point spatial temperature measurement. By measuring temperature at multiple locations (different dimensions in space), the system can identify heat sources more accurately and determine heat flow patterns, resolving the limitation of single thermistor measurements.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Measurement precision

If multiple thermistors are used to improve heat measurement accuracy, then measurement precision improves, but device complexity increases

Engineering Contradiction:
Improvetemperature measurement precisionVSAvoiddevice complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent segments the temperature measurement function into multiple distributed thermistor units rather than using a single complex measurement system. Each thermistor is a simple component, but their distributed arrangement provides comprehensive temperature monitoring with high precision without requiring complex individual sensors.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent uses the device's existing structural features (housing, component locations) to determine optimal thermistor placement. The system leverages the natural thermal pathways and structural geometry of the device itself to guide sensor positioning, eliminating the need for additional complex positioning mechanisms or calibration systems.

Inventive Principle:
Principle #25Self-service

Data Source

PatentUS11709530B2Electronic device and operation control method thereof
Publication Date: 2023.07.25 SAMSUNG ELECTRONICS CO LTD
  • US11709530B2 patent drawing
  • US11709530B2 patent drawing
  • US11709530B2 patent drawing

AI summary

A method of an electronic device are provided in which current consumption for one or more components of the electronic device is compared with a predetermined current. A first surface temperature of the electronic device is determined based on the comparison and power consumption of the one or more components. A location is detected where heat corresponding to the first surface temperature is generated. A second surface temperature of the electronic device is obtained based on power consumption of a component disposed in the electronic device corresponding to the location where the heat is generated. A target temperature is set based on the obtained second surface temperature. The component is controlled to reduce the power consumption of the component based on the target temperature.