Thermal Control Logic for High Power Device Low Temperature Operation
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Solution Overview
Problem
High performance electronic devices, such as ASICs and microprocessors, often fail to operate reliably at low ambient temperatures, as they are primarily optimized for higher temperatures, leading to unreliable function or failure in harsh industrial and military applications where temperatures can drop to negative 40 degrees Celsius or Fahrenheit.
Innovation Solution
A method and system utilizing embedded thermal sensors to monitor temperatures and initiate pre-heating using a localized heating source to raise the device's temperature to operational levels before applying power, with self-heating mechanisms maintaining the temperature, and an embedded or attached heating source assisting if necessary, to extend the low-end operational temperature range independently of ambient temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high performance electronic devices are optimized for high ambient temperatures, then they achieve high performance and reliability at those temperatures, but they fail to operate reliably at low ambient temperatures
Solution Approach 1:
The patent applies preliminary action by implementing a pre-heating mechanism that activates before the device is fully powered on when ambient temperature is below a threshold. The pre-heater raises the device temperature to within the operational range before main power is applied, ensuring reliable operation. This preliminary thermal preparation resolves the contradiction by enabling low-temperature operation without compromising the device's high-temperature optimization
Solution Approach 2:
The patent changes the temperature parameter dynamically by monitoring ambient temperature and adjusting the device's thermal state accordingly. When ambient temperature falls below a threshold, the system activates heating elements to raise the internal temperature to operational levels. This parameter change approach allows the device to adapt to varying temperature conditions while maintaining reliability
2Adaptability or versatility
If pre-heating is applied to raise device temperature to operational levels, then low temperature operation becomes possible, but additional heating components and control logic are required
Solution Approach 1:
The patent applies universality by designing heating elements that serve dual purposes: they function as temperature sensors through their resistance characteristics and as heating elements when activated. This multi-functionality reduces the need for separate sensing and actuating components, thereby limiting the increase in device complexity while still enabling low-temperature operation capability
Solution Approach 2:
The patent implements self-service through a feedback control mechanism where the temperature control logic continuously monitors device temperature and automatically activates or deactivates the pre-heater based on threshold comparisons. This self-regulating approach minimizes the need for complex external control systems while ensuring proper thermal management
3Use of energy by stationary object
If self heating is used to maintain device temperature, then operational temperature can be maintained without external heating, but self heating may be insufficient at very low ambient temperatures
Solution Approach 1:
The patent applies partial action by using self-heating from operational components to maintain temperature during normal operation, which is sufficient for moderate low-temperature conditions. When ambient temperatures are extremely low, the system supplements self-heating with the pre-heater to ensure adequate temperature maintenance. This layered approach balances energy efficiency with reliable temperature maintenance across different temperature extremes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures reliable operation of high power devices across a broader temperature range, enabling them to function effectively in low-temperature environments by maintaining operational temperatures through a combination of pre-heating and self-heating, thus enhancing system performance and reliability.
Implementation Method 1
Temperature control logic utilizes an embedded thermal sensor to locally monitor temperatures within key components of a host device or system
Implementation Method 2
the temperature control logic initiates pre-heating to raise the device's temperature to an operational level before applying system power
Implementation Method 3
The temperature control logic maintains the operational temperature of the device by using the power dissipated by components within the operating device (i.e., self heating) as a heating source
Data Source
AI summary
A method and system for efficiently extending the operating temperature range of high power components within a system/device. An embedded monitor measures local temperatures such as junction temperatures of components. When the measured temperature is less than the lowest operational temperature threshold of the component, temperature control logic initiates pre-heating to raise the component's temperature to an operational level, utilizing a heating source. The component (or device) is made operational only when the temperature is at or above the operational level. The temperature control logic maintains the operational temperature of the component using the high power dissipated by components within the operating system/device as a self heating source. If self heating is unable to maintain the operational temperature, the heating source is utilized to assist in maintaining the component's operational temperature, and thereby extends the useable operational temperature range of the system in which the components are employed.