Thermal Control Assembly with Extracted Pedestal for Rapid Temperature Response

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Solution Overview

Problem

Maintaining a constant temperature of electronic devices during testing is challenging due to varying instantaneous power dissipation, especially as transistor density increases, leading to fluctuations in temperature and speed, which existing thermal control systems struggle to manage effectively.

Innovation Solution

A thermal control assembly comprising a heat sink, a heater element, and a thermally conductive pedestal, where the pedestal is interposed between the heat sink and the heater element, allowing for improved thermal conductivity and responsiveness by eliminating the extra thermal mass and additional interface resistance, and featuring a thermally conductive interface material and a detachable sub-assembly for flexible sizing and positioning.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If a conventional thermal control system with heater interposed between heat sink and device is used, then the thermal control function is provided, but the thermal mass and interface resistance increase, reducing temperature responsiveness

Engineering Contradiction:

Improvetemperature responsivenessVSAvoidthermal mass

Core Design Contradiction:

SpeedVSDevice complexity

Solution Approach 1:

The patent extracts the pedestal from the thermal control path between the heat sink and the device. By removing this intermediate component, the thermal mass and interface resistance are reduced, allowing faster temperature responsiveness when controlling electronic devices during testing.

Inventive Principle:

Principle #2Taking out (Extraction)

2Productivity

If the instantaneous power dissipation of the chip varies widely during speed testing, then the testing capability is enhanced, but the temperature fluctuates significantly, making temperature control difficult

Engineering Contradiction:

Improvetesting capabilityVSAvoidtemperature stability

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The patent changes the thermal parameters of the control system by eliminating the pedestal, thereby reducing thermal mass and interface resistance. This allows the system to rapidly adjust to power dissipation variations during chip speed testing, maintaining temperature stability despite wide fluctuations in instantaneous power consumption.

Inventive Principle:

Principle #35Parameter changes

3Productivity

If transistor density is increased to improve device performance, then the processing capability is enhanced, but the instantaneous power dissipation increases, causing larger temperature variations

Engineering Contradiction:

Improveprocessing capabilityVSAvoidinstantaneous power dissipation

Core Design Contradiction:

ProductivityVSPower

Solution Approach 1:

The patent modifies the thermal control system parameters by removing the pedestal, reducing thermal mass to enable faster response to power dissipation changes. This allows effective temperature control of high-density transistor devices that exhibit large instantaneous power variations during operation.

Inventive Principle:

Principle #35Parameter changes

4Strength

If additional interface materials are used to improve thermal contact, then the thermal conductivity is enhanced, but the thermal mass and complexity increase

Engineering Contradiction:

Improvethermal conductivityVSAvoidinterface structure

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The patent removes the pedestal interface structure from the thermal control path. This elimination reduces both thermal mass and structural complexity while maintaining effective thermal contact between the heat sink and device through direct or simplified interface arrangements.

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution significantly improves temperature responsiveness and accuracy, reducing overshoot and recovery time by minimizing thermal resistance and thermal mass, allowing for precise temperature control even with rapid changes in power dissipation.

Implementation Method 1

the heat sink has a temperature below a desired set point temperature for the device... allow heat to be transferred from the device to the heat sink through the pedestal and heater element

Methodology Applied

Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 2

The heater element is controlled to apply heat to the device when the temperature of the device falls below the set point temperature

Methodology Applied

Scientific EffectJoule heating: Joule Heating

Implementation Method 3

The heater element is controlled (e.g., turned off) to allow heat to be transferred from the device to the heat sink through the pedestal and heater element

Methodology Applied

Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 4

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11039528B2Assembly and sub-assembly for thermal control of electronic devices

Publication Date: 2021.06.15 DELTA DESIGN INC

AI summary

An assembly for controlling the temperature of a device includes: a heat sink configured to be maintained at a temperature below a desired set point temperature; a heater element having a surface configured to be thermally coupled to a surface of the device; and a thermally conductive pedestal interposed between the heat sink and the heater element. The heater is configured to apply heat to the device when the temperature of the device falls below the set point temperature, and heat is transferable to the heat sink through the pedestal and heater element when the temperature of the device is above the set point temperature.